SMARTCARD STMicroelectronics, SMARTCARD Datasheet

SMARTCARD

Manufacturer Part Number

SMARTCARD

Description

Ordering Information For Package And Delivery

Manufacturer

STMicroelectronics

Datasheet

1.SMARTCARD.pdf (2 pages)

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INTRODUCTION

The manufacturing process of Smartcards in-

volves various components and technologies in

order to issue a finished product:

– micromodules,

– flat packages,

– wafers.

Dedicated package for Smartcard products, the

micromodule type depends on the size of the

product and on the application.

Table 1 lists all available micromodules.

For applications which require surface mount tech-

nology, suitable for PC cards, or other security

modules, STMicroelectronics offers flat packages

listed In Table 2.

For issuer production need, ST offers sawn and

unsawn wafers deliveries, listed in Table 3.

Figure 1. Delivery form

September 2001

This is Brief Data from STMicroelectronics. Details are subject to change without notice. For complete data, please contact

your nearest Sales Office or SmartCard Products Divison, Rousset, France. Fax: (+33) 4 42 68 87 29.

MICROMODULES

FLAT PACKAGES

WAFERS

Micromodule

8” Wafer

SO20

261a.ai

Notch

Table 1. Micromodules in super 35 standard

tape

Table 2. Flat Packages

Table 3. Wafers

D1, D2

D3, D4

Type

W00

W20

W40

QF4

D15

D68

O20

R20

S2x

R4x

S4x

T4x

For Package And Delivery

SMARTCARD MCU

180 µm sawn wafers on insolated UV tape

SO20 on tape and reel for MCU products

8 contacts for dual contact contactless

6 contacts for dual contact contactless

Unsawn wafers, 750 µm thickness

Unsawn wafers, 275 µm thickness

Unsawn wafers, 180 µm thickness

180 µm sawn wafers on blue tape

Ordering Information

280 µm sawn wafers on UV tape

180 µm sawn wafers on UV tape

8 contacts with ring MCU cards

Full contactless for MCU cards

8 contacts for memory cards

6 contacts for memory cards

TQFP44 for MCU products

8 contacts for MCU cards

SO20 for MCU products

Description

MCU cards

DATA BRIEFING

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