GP1600FSM12 Dynex Semiconductor, GP1600FSM12 Datasheet - Page 9
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GP1600FSM12
Manufacturer Part Number
GP1600FSM12
Description
Single Switch Igbt Module Advance Information
Manufacturer
Dynex Semiconductor
Datasheet
1.GP1600FSM12.pdf
(10 pages)
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
6x M4
5
Copper terminal thickness, Auxiliary and Gate pin = 0.9 ± 0.1
Copper terminal thickness, Main Terminal pins = 1.5 ± 0.1
Main Terminal screw plastic hole depth (M8) = 16.8 ± 0.3
Auxiliary and Gate pin plastic hole depth (M4) = 9± 0.3
14.5
Aux C
11
5
Aux E
6
G
62
Module outline type code: F
Nominal weight: 1050g
35
E1
E2
15
140
15
20
C1
C2
4x M8
62
6x Ø7
GP1600FSM12
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