VSMG2720 Vishay, VSMG2720 Datasheet - Page 4

• Manufacturer Part Number: VSMG2720
• Description: High Speed Infrared Emitting Diode, Rohs Compliant, 830 Nm, Gaalas Double Hetero
• Manufacturer: Vishay

VSMG2720
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
SOLDER PROFILE
www.vishay.com
4
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020B for
19841
Drawing-No.: 6.541-5067.01-4
Issue: 5; 04.11.08
Preconditioning acc. to JEDEC, Level 2a
20541
300
250
200
150
100
50
0
0
C
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
max. 120 s
100
Time (s)
3
Pin identification
3.5
Ø 2.4
+ 0.15
150
± 0.2
For technical questions, contact: [e-mail]
max. 100 s
max. 30 s
200
High Speed Infrared Emitting Diode, RoHS
Compliant, 830 nm, GaAlAs Double Hetero
max. 260 °C
250
245 °C
A
300
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T
Moisture sensitivity level 2a, acc. to J-STD-020B.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
1.6 (1.9)
Mounting Pad Layout
technical drawings
according to DIN
specifications
amb
< 30 °C, RH < 60 %
1.2
4
area covered with
solder resist
Document Number: 81597
Rev. 1.1, 28-Nov-08