Symbol
V
V
V
V
I
I
I
E
dv/dt
P
P
P
R
R
Symbol
V
V
I
I
R
g
T
T
T
T
Weight
D25
DM
AR
GSS
DSS
NChannel Enhancement Mode
N-Channel Enhancement Mode Switch Mode RF MOSFET
Low
Low Capacitance Z-MOS
High dv/dt
Optimized for RF Operation
Nanosecond Switching
Ideal for Class C, D, & E Applications
fs
J
JM
stg
L
DSS
DGR
GS
GSM
AR
DC
DHS
DAMB
DSS
GS(th)
thJC
thJHS
DS(on)
Q
g
and
Test Conditions
T
T
Continuous
Transient
T
T
T
T
I
T
I
T
T
Test Conditions
V
V
V
V
V
V
Pulse test, t ≤ 300µS, duty cycle d ≤ 2%
V
1.6mm(0.063 in) from case for 10 s
S
S
J
J
c
c
c
c
j
c
c
GS
DS
GS
DS
GS
GS
DS
≤ I
= 0
≤ 150°C, R
= 25°C to 150°C
= 25°C to 150°C; R
= 25°C
= 25°C, pulse width limited by T
= 25°C
= 25°C
= 25°C, Derate 4.4W/°C above 25°C
= 25°C
R
=0
DM
= V
= 0.8V
= 50V, I
= 0 V, I
= ±20 V
= 20 V, I
g
, di/dt ≤ 100A/µs, V
GS
, I
DSS
D
D
D
DC
D
G
= 4 ma
= 250µΑ
= 0.5I
, V
= 0.5I
= 0.2Ω
DS
D25
= 0
D25
GS
, pulse test
TM
= 1 MΩ
T
T
DD
J
J
MOSFET Process
= 25C
=125C
≤ V
DSS
JM
,
Characteristic Values
(
T
J
= 25°C unless otherwise specified)
min.
600
-55
-55
3.5
0.437
4.25
15.2
typ.
175
300
3.5
Maximum Rat-
>200 V/ns
TBD
TBD
TBD
TBD C/W
TBD C/W
600
600
±20
±30
3.0
+ 175
max.
+175
18
90
18
±100
5 V/ns
6.5
50
IXZR16N60 & IXZR16N60A/B
1
ings
mJ
Z-MOS RF Power MOSFET
W
W
W
V
V
V
V
A
A
A
mA
nA
µA
°C
°C
°C
°C
Ω
V
V
S
g
Features
•
−
−
−
•
•
−
−
•
•
•
Advantages
•
•
•
•
Isolated Substrate
IXYS advanced Z-MOS process
Low gate charge and capacitances
Very low insertion inductance (<2nH)
No beryllium oxide (BeO) or other
hazardous materials
High Performance RF Z-MOS
Optimized for RF and high speed
Common Source RF Package
Isolated Package, no insulator
required
high isolation voltage (>2500V)
excellent thermal transfer
Increased temperature and power
cycling capability
easier to drive
faster switching
Low R
V
I
R
P
D25
DSS
DC
DS(on)
A = Gate Source Drain
B = Drain Source Gate
DS(on)
=
=
=
=
0.44 Ω
18.0 A
600 V
TM
TBD