2DAC-C16R Bourns, Inc., 2DAC-C16R Datasheet - Page 3

• Manufacturer Part Number: 2DAC-C16R
• Description: Integrated Passive & Active Device Using Csp
• Manufacturer: Bourns, Inc.

Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Figure 4 contains a block diagram of the CSP device. This diagram includes the pin
names and basic electrical connections associated with each channel.
Block Diagram
2DAC-C16R Series - Integrated Passive & Active Device using CSP
GROUND
GROUND
EXT1
EXT2
EXT3
EXT4
EXT5
EXT6
±6.5 V
±6.5 V
±6.5 V
±6.5 V
±6.5 V
±6.5 V
Fig. 4 – Device Block Diagram
±6.5 V
±6.5 V
±6.5 V
±6.5 V
±6.5 V
±6.5 V
GROUND
GROUND
EXT12
EXT11
EXT10
EXT9
EXT8
EXT7
Thinfilm
Model
Chipscale
No. of Solder Bumps
Packaging Option
Terminations
The device will be laser marked on the
backside according to the following
Fig. 5 scheme below. Position A1, on the
Bump Grid is located at the top left of
the die when the die is orientated so that
the mark is read in the normal fashion.
Please consult Bourns’ Thin Film on
Silicon using CSP Users Guide
Application Note for notes on PCB
design and SMT processing.
Marking
PCB Design and SMT Processing
How to Order
LOCATION
R = Tape and Reel
LF = Sn/Ag/Cu (lead free)
Blank = Sn/Pb
PIN A1
Packaged 3000 pcs. / 7 ” reel
Fig. 5 – Backside Laser Mark
A
B
C
D
1
Lotcode
2 DAC - C16R
2
DAC
3
4
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