2DAC-C16R Bourns, Inc., 2DAC-C16R Datasheet

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2DAC-C16R

Manufacturer Part Number
2DAC-C16R
Description
Integrated Passive & Active Device Using Csp
Manufacturer
Bourns, Inc.
Datasheet
1.2DAC-C16R.pdf (4 pages)

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
2DAC-C16R
Manufacturer:
MIT
Quantity:
10
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
This application specific integrated passive component is
designed to provide all of the necessary ESD protection
on the data port of a portable electronic device. The ESD
protection provided by the component enables the data
port to withstand ±8 KV Contact / ±15 KV Air Discharge
when tested according to the method specified in IEC
61000-4-2. The component incorporates 12 identical ports
and is supplied in a 16 pin CSP package which is intended
to be mounted directly onto an FR4 printed circuit board.
This package is designed to meet typical thermal cycle
and bend test specifications without the use of an
underfill material.
Note:
Electrical Characteristics
(T
Zener Diode
Breakdown Voltage @ 1 mA
Leakage Current @ 3 V
Diode Capacitance @ 1 V & 1 MHz
ESD Performance (Note 1 & 2)
Thermal Characteristics
(T
Operating Temperature
Storage Temperature
Total Power Dissipation @ 70 °C
General Information
Electrical & Thermal Characteristics
A
A
= 25 °C unless otherwise noted)
Withstand
Let Through
= 25 °C unless otherwise noted)
Contact Discharge
Air Discharge
Contact Discharge
Air Discharge
1. The IEC 61000-4-2 test method will be adapted for component level testing. The device will provide the specified ESD protection
2. “Let Through” is a measure of the component of an incident ESD transient that the protection device allows through to the down
performance on the “EXT1 – 12” pins only.
stream circuitry.
2DAC-C16R Series - Integrated Passive & Active Device using CSP
Features
Lead free versions available
RoHS compliant (lead free version)*
New Product Development
Integrated Passive Device
ESD Protection to IEC61000-4-2 Spec.
Symbol
V
T
C
P
T
I
BR
stg
R
D
T
J
Minimum
±15
-40
-60
8.5
SOLDER
±8
BUMPS
6
Figure 1 – CSP Format
Nominal
10.5
7.2
25
25
Maximum
±150
±150
+125
12.5
+85
100
8
1
SILICON
DIE
Unit
mW
uA
pF
kV
kV
°C
°C
V
V
V

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2DAC-C16R Summary of contents

Page 1

... Customers should verify actual device performance in their specific applications. Features Lead free versions available RoHS compliant (lead free version)* New Product Development Integrated Passive Device ESD Protection to IEC61000-4-2 Spec. 2DAC-C16R Series - Integrated Passive & Active Device using CSP SOLDER BUMPS Symbol Minimum V 6 ...

Page 2

... Daisy-Chain test device. A 25-Pin Daisy Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This array featuring 0.5 mm pitch solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2DAC-C16R and is thus deemed a worse case for Thermal Cycle testing. ...

Page 3

... Series - Integrated Passive & Active Device using CSP Block Diagram Figure 4 contains a block diagram of the CSP device. This diagram includes the pin names and basic electrical connections associated with each channel. EXT1 ±6.5 V GROUND EXT2 ±6.5 V EXT3 ±6.5 V EXT4 ±6.5 V EXT5 ± ...

Page 4

... Series - Integrated Passive & Active Device using CSP Device Pin Out The Pin-Out for the device is shown in Fig. 6. Note also that the device is shown with bumps facing up. EXT10 EXT4 D EXT11 C EXT12 B EXT1 A EXT2 EXT3 EXT4 Fig. 6 (a) - Device Pin Out “Bumps Up” View Packaging The product will be dispensed in an 8mm x 4mm Tape and Reel format - see Fig ...

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