2DAC-C16R Bourns, Inc., 2DAC-C16R Datasheet - Page 2

• Manufacturer Part Number: 2DAC-C16R
• Description: Integrated Passive & Active Device Using Csp
• Manufacturer: Bourns, Inc.

This is a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die,
provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The grid pitch is
0.5 mm. The dimensions for the CSP packaged device are shown in Fig. 2 below.
Reliability data exists and continues to be gathered on an ongoing basis for Bourns Integrated Passive and Active Devices using CSP
packaging.
“Package level” testing of the integrity of the solder joint is carried out on an independent Daisy-Chain test device. A 25-Pin Daisy
Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This is a 5 x 5 array featuring 0.5 mm pitch
solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2DAC-C16R and is thus deemed a
worse case for Thermal Cycle testing.
“Silicon level” reliability performance will be assured by similarity to other Integrated Passive and Active Devices using CSP product
from Bourns.
This section contains the schematic (See Fig. 3 below) for the single channel in the integrated passive device. Note that the electrical
parameter of primary interest is the ESD performance.
Mechanical Characteristics
Reliability
Individual Channel Schematic
2DAC-C16R Series - Integrated Passive & Active Device using CSP
Fig. 3 – Channel Schematic
GROUND
EXT1-12
±6.5 V
(33.78 ± 1.57)
858 ± 40
(8.86 ± 0.79)
225 ± 20
Key Design Parameters
Zener Diode
V
I
C
(9.78 ± 1.78)
R
248.5 ± 45
BR
: 1 uA Max @ V
T
: 8.5 pF Min, 10.5 pF Typ, 12.5 pF Max @ V
Fig. 2 – Device Mechanical Drawing
: 6 V Min, 8 V Max @ I
BUMP A1/PIN 1
INDICATOR
A1
A2
A3
A4
R
(19.69)
= 3 V
500
B1
B2
B3
B4
(78.62 ± 1.78)
(16.87 ± 1.78)
1997 ± 45
(11.81)
BR
428.5 ± 45
300
= 1 mA
Customers should verify actual device performance in their specific applications.
DIA.
C1
C2
C3
C4
(1.78 ± 1.78)
(19.69)
45 ± 45
500
D1
D2
D3
D4
R
(9.78 ± 1.78)
BOURNS
248.5 ± 45
LOGO
= 1 V & F = 1 MHz
(1.78 ± 1.78)
(85.71 ± 1.78)
Specifications are subject to change without notice.
2177 ± 45
45 ± 45
DIMENSIONS =
MICRONS
(MILS)