FMA18N25G Fuji Electric holdings CO.,Ltd, FMA18N25G Datasheet - Page 10

• Manufacturer Part Number: FMA18N25G
• Description: N-channel Silicon Power Mosfet
• Manufacturer: Fuji Electric holdings CO.,Ltd

･ The immersion depth of the lead should basically be up to the lead stopper and the distance should
･ When flow-soldering, be careful to avoid immersing the package in the solder bath.
Recommended soldering condition
Fuji Electric Device Technology Co.,Ltd.
･ Before touching a MOSFET terminal, Discharge any static electricity from your body and clothes
･ When soldering, in order to protect the MOSFETs from static electricity, ground the soldering iron
･ You must design the MOSFETs to be operated within the specified maximum ratings(voltage,
･ Consider the possible temperature rise not only for the channel and case, but also for the outer
･ Do not directly touch the leads or package of the MOSFETs while power is supplied or during
･ The MOSFETs are made of incombustible material. However, if a MOSFET fails, it may emit
･ The MOSFETs should not used in an environment in the presence of acid, organic matter, or
･ The MOSFETs should not used in an irradiated environment since they are not radiation-proof.
Installation
･ Soldering involves temperatures which exceed the device storage temperature rating. To avoid
be a maximum of 1.5mm from the device.
Through-Hole
by grounding out through a high impedance resistor (about 1M )
or soldering bath through a low impedance resistor.
current, temperature, etc.) to prevent possible failure or destruction of devices.
leads.
operation in order to avoid electric shock and burns.
smoke or flame. Also, operating the MOSFETs near any flammable place or material may cause
the MOSFETs to emit smoke or flame in case the MOSFETs become even hotter during
operation. Design the arrangement to prevent the spread of fire.
corrosive gas(hydrogen sulfide, sulfurous acid gas etc.)
device damage and to ensure reliability, observe the following guidelines from the quality
assurance standard.
Categories
◎：Possible
Solder temperature and duration (through-hole package)
Solder temperature
Packages
T-Pack(L)
TO-3PL-7
TO-220F
TO-3PL
TO-3PF
TO-247
TO-220
TO-3P
○：Limited to 1 time
350 10  C
260 5  C
(Full dipping)
Soldering
Wave
×
×
×
×
×
×
×
×
×：Unable
(Only terminal)
Soldering
Wave
◎
◎
◎
◎
◎
◎
◎
◎
3.5 0.5 seconds
10 1 seconds
Duration
Methods
Infrared
MS5F06392
Reflow
×
×
×
×
×
×
×
×
Reflow
Air
×
×
×
×
×
×
×
×
(Re-work)
Soldering
10 / 19
iron
○
○
○
○
○
○
○
○
H04-004-03