NTF3055L108 ON Semiconductor, NTF3055L108 Datasheet

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NTF3055L108

Manufacturer Part Number
NTF3055L108
Description
Power Mosfet 3.0 A, 60 V, Logic Level, Nchannel Sot223
Manufacturer
ON Semiconductor
Datasheet

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NTF3055L108
Power MOSFET
3.0 A, 60 V, Logic Level, N−Channel
SOT−223
power supplies, converters and power motor controls and bridge
circuits.
Features
Applications
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size, 1 oz.
2. When surface mounted to an FR4 board using minimum recommended pad
© Semiconductor Components Industries, LLC, 2005
December, 2005 − Rev. 4
MAXIMUM RATINGS
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
Gate−to−Source Voltage
Drain Current
Total Power Dissipation @ T
Total Power Dissipation @ T
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Thermal Resistance
Maximum Lead Temperature for Soldering
Designed for low voltage, high speed switching applications in
Pb−Free Packages are Available
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
(Cu. Area 0.0995 in
size, 2−2.4 oz. (Cu. Area 0.272 in
− Continuous @ T
− Continuous @ T
− Single Pulse (t
Derate above 25°C
Energy − Starting T
(V
I
Purposes, 1/8″ from case for 10 seconds
L(pk)
− Continuous
− Non−repetitive (t
DD
−Junction−to−Ambient (Note 1)
−Junction−to−Ambient (Note 2)
= 7.0 Apk, L = 3.0 mH, V
= 25 Vdc, V
p
Rating
GS
A
A
≤ 10 ms)
2
p
J
).
= 25°C
= 100°C
= 5.0 Vdc,
= 25°C
≤ 10 ms)
(T
GS
C
= 25°C unless otherwise noted)
A
A
Preferred Device
= 1.0 MW)
= 25°C (Note 1)
= 25°C (Note 2)
DS
2
= 60 Vdc)
).
Symbol
T
V
V
R
R
J
V
E
I
P
DSS
DGR
, T
T
I
I
DM
qJA
qJA
GS
AS
D
D
D
L
stg
to 175
Value
0.014
± 15
± 20
72.3
−55
114
260
3.0
1.4
9.0
2.1
1.3
60
60
74
1
Watts
Watts
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
mJ
°C
°C
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
3055L
A
Y
W
G
(Note: Microdot may be in either location)
1
ORDERING INFORMATION
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
2
R
MARKING DIAGRAM
G
DS(on)
PIN ASSIGNMENT
http://onsemi.com
3
Gate
3.0 A, 60 V
1
N−Channel
4
Drain
4
2
= 120 mW
D
Publication Order Number:
Drain
S
3
Source
CASE 318E
SOT−223
STYLE 3
NTF3055L108/D
3055LG
AYW
G

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NTF3055L108 Summary of contents

Page 1

... 120 mW DS(on) N−Channel SOT−223 CASE 318E 1 STYLE MARKING DIAGRAM AYW = Device Code 3055LG = Assembly Location G = Year = Work Week = Pb−Free Package PIN ASSIGNMENT Drain Gate Drain Source ORDERING INFORMATION Publication Order Number: NTF3055L108/D ...

Page 2

... Fall Time Gate Charge SOURCE−DRAIN DIODE CHARACTERISTICS Forward On−Voltage Reverse Recovery Time Reverse Recovery Stored Charge 3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%. 4. Switching characteristics are independent of operating junction temperatures. NTF3055L108 (T = 25°C unless otherwise noted) A Symbol V (BR)DSS I ...

Page 3

... V GATE−TO−SOURCE VOLTAGE (VOLTS 1.8 GS 1.6 1.4 1.2 1 0.8 0.6 −50 − 100 T , JUNCTION TEMPERATURE (°C) J Figure 5. On−Resistance Variation with Temperature NTF3055L108 3 & 25° 2 ...

Page 4

... 0.1 100 ms R LIMIT DS(on) THERMAL LIMIT PACKAGE LIMIT 0.01 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area NTF3055L108 25° iss 2 oss 1 rss Drain−to−Source Voltage vs. Total Charge 3 ...

Page 5

... ORDERING INFORMATION Device NTF3055L108T1 NTF3055L108T1G NTF3055L108T3 NTF3055L108T3G NTF3055L108T3LF NTF3055L108T3LFG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTF3055L108 0.01 0 TIME (s) Figure 13. Thermal Response Package SOT− ...

Page 6

... J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1. 0.264 0.287 6.70 7.30 STYLE 3: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN 6.3 mm inches ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NTF3055L108/D ...

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