STY30NA50 STMicroelectronics, STY30NA50 Datasheet

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STY30NA50

Manufacturer Part Number
STY30NA50
Description
N - Channel Enhancement Mode Fast Power Mos Transistor
Manufacturer
STMicroelectronics
Datasheet

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Part Number:
STY30NA50
Manufacturer:
ST
Quantity:
12 500
Part Number:
STY30NA50
Manufacturer:
ST
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DESCRIPTION
T he Max247
power package exibiting the same footprint as the
industry standard T O-247, but designed to
accomodate much larger silicon chips, normally
supplied in bigger packages such as TO -264. The
increased die capacity makes the device ideal to
reduce component count in multiple paralleled
designs and save board space with respect to
larger packages.
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
March 1996
STY30NA50
Symbol
TYPICAL R
EFFICIENT AND RELIABLE MOUNTING
THROUGH CLIP
REPETITIVE AVALANCHE TESTED
LOW INTRINSIC CAPACITANCE
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
REDUCED THRESHOLD VOLTAGE SPREAD
HIGH CURRENT, HIGH SPEED SWITCHING
SWITCH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES (UPS)
I
V
DM
V
V
P
T
DGR
30V GATE TO SOURCE VOLTAGE RATING
I
I
T
DS
GS
stg
D
D
t ot
TYPE
( )
j
Drain-source Voltage (V
Drain- gate Voltage (R
Gate-source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
Total Dissipation at T
Derating Factor
St orage Temperature
Max. Operating Junction Temperature
TM
DS(on)
package is a new high volume
500 V
V
= 0.15
DSS
< 0.175
Parameter
R
DS(on)
c
GS
= 25
GS
N - CHANNEL ENHANCEMENT MODE
= 20 k )
= 0)
o
C
c
c
FAST POWER MOS TRANSISTOR
30 A
= 25
= 100
I
D
o
C
o
C
INTERNAL SCHEMATIC DIAGRAM
-55 to 150
Value
Max247
500
500
120
300
150
2.4
30
19
30
STY30NA50
TM
PRELIMINARY DATA
W/
Uni t
o
o
W
V
V
V
A
A
A
C
C
o
C
1/4

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STY30NA50 Summary of contents

Page 1

... Pulse width limited by safe operating area March 1996 FAST POWER MOS TRANSISTOR Max247 INTERNAL SCHEMATIC DIAGRAM Value 500 500 100 120 C 300 2.4 -55 to 150 150 STY30NA50 PRELIMINARY DATA TM Uni 1/4 ...

Page 2

... STY30NA50 THERMAL DATA R Thermal Resistance Junction-case t hj- Thermal Resistance Junction-ambient t hj- amb R Thermal Resistance Case-Heatsink thc with Conductive Grease AVALANCHE CHARACTERISTICS Symb ol Parameter I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited by T max Single Pulse Avalanche Energy AS o (starting ...

Page 3

... D GS Test Cond ition s Min. = 400 4 Test Cond ition s Min di/dt = 100 100 150 C j STY30NA50 Typ . Max 240 A/ s 245 320 120 nC Typ . Max 100 ns 30 ...

Page 4

... STY30NA50 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsabilit y for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice ...

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