CY23S08 Cypress Semiconductor Corporation., CY23S08 Datasheet - Page 9

• Manufacturer Part Number: CY23S08
• Description: 3.3v Zero Delay Buffer
• Manufacturer: Cypress Semiconductor Corporation.

Package Drawings and Dimensions
Document #: 38-07265 Rev. *G
0.85[0.033]
0.95[0.037]
0.65[0.025]
BSC.
0.050[1.270]
BSC
8
9
4.90[0.193]
5.10[0.200]
Figure 10. 16-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z16
0.386[9.804]
0.393[9.982]
0.0138[0.350]
0.0192[0.487]
0.19[0.007]
0.30[0.012]
16
1
0.05[0.002]
0.15[0.006]
4.30[0.169]
4.50[0.177]
6.25[0.246]
6.50[0.256]
16
1
Figure 9. 16-Lead (150-Mil) SOIC S16
PIN 1 ID
1.10[0.043] MAX.
0.150[3.810]
0.157[3.987]
0.004[0.102]
0.0098[0.249]
0.061[1.549]
0.068[1.727]
PIN 1 ID
SEATING
PLANE
0.076[0.003]
0.230[5.842]
0.244[6.197]
0.004[0.102]
SEATING PLANE
GAUGE
PLANE
0.25[0.010]
0°~8°
BSC
0°-8°
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
PACKAGE WEIGHT 0.15gms
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
0.016[0.406]
0.035[0.889]
0.50[0.020]
0.70[0.027]
PART #
0.010[0.254]
0.016[0.406]
51-85068-*B
51-85091-*A
MAX.
0.0075[0.190]
0.0098[0.249]
X 45°
0.09[[0.003]
0.20[0.008]
CY23S08
Page 9 of 10
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