SUF-5000 Sirenza Microdevices, SUF-5000 Datasheet - Page 4

• Manufacturer Part Number: SUF-5000
• Description: Dc-6.5 Ghz, Gaas Hbt Mmic Amplifier
• Manufacturer: Sirenza Microdevices

Pad Description
Device Assembly
303 S. Technology Ct.
Broomfield, CO 80021
Bottom
Pad #
Die
1
2
RF
Function
OUT
GND
RF
/ Bias
IN
DC Block
This pad is DC coupled and matched to 50 Ohms.
An external DC block is required.
This pad is DC coupled and matched to 50 Ohms.
Bias is applied through this pad.
Die bottom must be connected to RF/DC ground
using silver-filled conductive epoxy.
50 Ω Line
Description
1
Phone: (800) SMI-MMIC
Interconnect
Wire or Ribbon
4
3-5 mil gap
2
SUF-5000 0.1-3.7 GHz Cascadable MMIC Amplifier
50 Ω Line
Choke
Notes:
1. All Dimensions in Inches [Millimeters].
2. No connection required for unlabeled bond pads.
3. Die Thickness is 0.004 (0.100).
4. Typical bond pad is 0.004 (0.100) square.
5. Backside metalization: Gold.
6. Backside is Ground.
7. Bond pad metalization: Gold.
DC Block
Bypass Cap(s)
+5V
Preliminary
http://www.sirenza.com
EDS-105419 Rev B