AMIS-30623 AMI Semiconductor, Inc., AMIS-30623 Datasheet - Page 67

• Manufacturer Part Number: AMIS-30623
• Description: Lin Microstepping Motordriver
• Manufacturer: AMI Semiconductor, Inc.

AMIS-30623 LIN Microstepping Motordriver
Notes:
(1) All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the
(2) These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder
(3) If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves
(4) Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e)
(5) Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)
21.0 Company or Product Inquiries
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22.0 Document History
Table 40: Document history
Version
1.0
2.1
3.0
AMI Semiconductor – June 2006, Rev 3.0
www.amis.com
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS
makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any
time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not
recommended without additional processing by AMIS for such applications. Copyright ©2006 AMI Semiconductor, Inc.
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
may stick to the heatsink (on top version).
downstream and at the side corners.
equal to or smaller than 0.65mm.
equal to or smaller than 0.5mm.
Date of Version
July 16, 2002
December 5
June 19, 2006
th
P
P
, 2005
Modifications/Additions
First non-preliminary issue
Complete review
Public release
67
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Data Sheet
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