AMIS-30623 AMI Semiconductor, Inc., AMIS-30623 Datasheet - Page 66

• Manufacturer Part Number: AMIS-30623
• Description: Lin Microstepping Motordriver
• Manufacturer: AMI Semiconductor, Inc.

AMIS-30623 LIN Microstepping Motordriver
20.0 Soldering
20.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
Ha
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount
ICs, or for printed-circu
20.2 Re
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re
e
Throughput time
Typical re-flow peak te
below 230°C.
20.3 Wa
Conventional single wave
c
s
If
D
pr
T
a
2
F
p
W
Table 39: Soldering Process
Package
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
omponent density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave
oldering method was specifically developed.
xample, infrared/convection heating in a conveyor type oven.
pplications.
0.4 Manual Soldering
art of the lead. Contact time must be limited to 10 seconds at up to 300°C.
ypical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most
ix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
uring placement and before soldering, the pack ge must be fixed with a droplet of adhesive. The adhesive can be applied by screen
wave soldering is used the following conditions must be observed for optimal results:
AMI Semiconductor – June 2006, Rev 3.0
inting, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
hen using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
www.amis.com
ndbook IC26; Integrated Circuit Packa
1 Introduction to Soldering Surf
•
•
•
-flow Soldering
ve Soldering
Use a double-wave so
wave.
For packages with leads o
For pack
circuit bo
o
o
s (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
ages with leads on
ard. The footp
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of
the printe
Smaller than 1.2
board. The fo
it boar
mperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept
d-circuit board;
soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high
ds with high population densities. In these situations reflow soldering is often used.
otpr
ldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar
rint m
7mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit
n two sides and a pitch (e):
int must incor
ace Mount Packages
ust incorpor
four sides,
Wave
Not suitable
Not suitable (2)
Suitable
Not recommended (3)(4)
Not recommended (5)
ges” (document order number 9398 652 90011).
porate solder thieves at th
Soldering Method
ate solder thie
a
the footprint m
ve
Reflow(1)
Suitable
Suitable
Suitable
Suitable
Suitable
66
ust be pla
s downstream and at the side corners.
e downstream end.
ced at a 45º angle to the transport direction of the printed-
Data Sheet
flowing; for