ADIS16203 Analog Devices, Inc., ADIS16203 Datasheet - Page 25

no-image

ADIS16203

Manufacturer Part Number
ADIS16203
Description
Programmable 360 Inclinometer
Manufacturer
Analog Devices, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADIS16203/PCBZ
Manufacturer:
Analog Devices Inc
Quantity:
135
Part Number:
ADIS16203CCCZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
POWER-ON RESET OPERATION
An internal power-on reset (POR) is implemented internally to
the ADIS16203. For VDD below 2.35 V, the internal POR holds the
ADIS16203 in reset. As VDD rises above 2.35 V, an internal timer
times out for typically 130 ms before the part is released from reset.
The user must ensure that the power supply has reached a stable
3.0 V minimum level by this time. Likewise, on power-down, the
internal POR holds the ADIS16203 in reset until VDD drops below
2.35 V. Figure 33 illustrates the operation of the internal POR in detail.
Once the power sequence is complete, the self-test sequence follows.
This sequence takes approximately 14 ms in high performance mode
and approximately 36 ms in normal mode. The power-up self-test
can be disabled using Bit 10 in the MSC_CTRL register if the start
time is a critical consideration.
SECOND-LEVEL ASSEMBLY
The ADIS16203 can be attached to the second-level assembly board
using SN63 (or equivalent) or lead-free solder. Figure 34 and Table 24
provide acceptable solder reflow profiles for each solder type. Note
that these profiles may not be the optimum profile for the user’s
application. In no case should 260°C be exceeded. It is recommended
that the user develop a reflow profile based upon the specific application.
In general, the lowest peak temperature and shortest dwell time above
the melt temperature of the solder result in less shock and stress to
the product. In addition, evaluating the cooling rate and peak tem-
perature can result in a more reliable assembly.
POR
VDD
T
T
P
L
T
SMIN
2.35V TYP
T
SMAX
Figure 33. Internal Power-On Reset Operation
Figure 34. Acceptable Solder Reflow Profiles
PREHEAT
t
25°C TO PEAK
t
S
RAMP-UP
TIME
130ms TYP
RAMP-DOWN
t
P
t
L
CRITICAL ZONE
T
L
TO T
P
Rev. 0 | Page 25 of 28
Table 24.
Profile Feature
Average Ramp Rate (T
Preheat
T
Time Maintained Above
Ramp-Down Rate
Time 25°C to Peak Temperature
EXAMPLE PAD LAYOUT
SMAX
Minimum Temperature
(T
Maximum Temperature (T
Time (T
Ramp-Up Rate
Liquidous (T
Liquidous Temperature (T
Time (t
Peak Temperature (T
Time Within 5°C of Actual
Peak Temperature (t
SMIN
to T
)
0.670 BSC
(12 PLCS)
1.
(1
L
127 BSC
L
6 PLCS)
SMIN to
)
L
T
)
SMAX
Figure 35. Example Pad Layout
) (t
L
p
s
to T
P
)
)
)
1.178 BSC
(8 PLCS)
P
)
SMAX
L
)
)
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to
120 sec
3°C/sec
183°C
60 sec to
150 sec
240°C +
0°C/–5°C
10 sec to
30 sec
6°C/sec max
6 minutes
max
7.873 BSC
Condition
(2 PLCS)
0.500 BSC
(16 PLCS)
ADIS16203
Pb-Free
3°C/sec max
150°C
200°C
60 sec to
150 sec
3°C/sec
217°C
60 sec to
150 sec
260°C +
0°C/–5°C
20 sec to
40 sec
6°C/sec max
8 minutes
max

Related parts for ADIS16203