MCP6S92 Microchip Technology Inc., MCP6S92 Datasheet - Page 35

• Manufacturer Part Number: MCP6S92
• Description: Single-ended, Rail-to-rail I/o, Low-gain Pga
• Manufacturer: Microchip Technology Inc.

10-Lead Plastic Micro Small Outline Package (MS) (MSOP)
 2004 Microchip Technology Inc.
p
c
B
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MO-187
Drawing No. C04-021
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
n
β
(F)
Dimension Limits
E1
E
Units
A2
A1
E1
D
B
n
p
A
E
L
F
c
α
β
φ
MIN
.030
.000
.016
.003
.006
2
1
0°
5°
5°
-
L1
D
.193 BSC
.118 BSC
.118 BSC
φ
.020 TYP
INCHES
.037 REF
NOM
L
10
.024
.033
.009
-
-
-
-
-
-
A1
MAX
A
.043
.037
.006
.009
.012
.031
15°
15°
8°
MIN
MCP6S91/2/3
0.75
0.00
0.40
0.08
0.15
0°
5°
5°
-
MILLIMETERS*
0.50 TYP.
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
10
0.85
0.60
0.23
A2
-
-
-
-
-
-
DS21908A-page 35
MAX
1.10
0.95
0.15
0.80
0.23
0.30
15°
15°
8°
α