MC74LVX50DTG ON Semiconductor, MC74LVX50DTG Datasheet

IC BUFFER HEX NON-INVERT 14TSSOP

MC74LVX50DTG

Manufacturer Part Number
MC74LVX50DTG
Description
IC BUFFER HEX NON-INVERT 14TSSOP
Manufacturer
ON Semiconductor
Series
74LVXr
Datasheets
1.MC74LVX50DTR2G.pdf (10 pages)
2.MC74LVX50DTG.pdf (6 pages)

Specifications of MC74LVX50DTG

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
6
Number Of Bits Per Element
1
Current - Output High, Low
4mA, 4mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Circuit Type
Silicon Gate
Current, Supply
20 μA
Function Type
3-Stages
Logic Function
Buffer
Number Of Circuits
Hex
Package Type
TSSOP-14
Special Features
Buffered Output
Temperature, Operating, Range
-40 to +85 °C
Voltage, Supply
2 to 3.6 V
Logic Family
LVX
Number Of Channels Per Chip
5
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 4 mA
Low Level Output Current
4 mA
Maximum Power Dissipation
200 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
6 / 6
Propagation Delay Time
13.6 ns at 2.7 V, 9.7 ns at 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MC74LVX50
Hex Buffer
fabricated with silicon gate CMOS technology.
output which provides high noise immunity and stable output. The
inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V
systems to 3.0 V systems.
Features
*For additional information on our Pb−Free strategy and soldering details, please
March, 2005 − Rev. 3
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The MC74LVX50 is an advanced high speed CMOS buffer
The internal circuit is composed of three stages, including a buffered
High Speed: t
Low Power Dissipation: I
High Noise Immunity: V
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Designed for 2.0 V to 3.6 V Operating Range
Low Noise: V
Pb−Free Packages are Available*
Semiconductor Components Industries, LLC, 2005
PD
OLP
= 4.1 ns (Typ) at V
= 0.5 V (Max)
NIH
CC
= 2 mA (Max) at T
= V
NIL
CC
= 28% V
= 3.3 V
CC
A
= 25 C
1
14
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
14
14
1
1
1
ORDERING INFORMATION
A
WL or L
Y
WW or W = Work Week
http://onsemi.com
CASE 948G
CASE 751A
SOEIAJ−14
DT SUFFIX
TSSOP−14
CASE 965
M SUFFIX
D SUFFIX
SOIC−14
= Assembly Location
= Wafer Lot
= Year
Publication Order Number:
14
1
14
1
14
DIAGRAMS
1
MARKING
74LVX50
MC74LVX50/D
AWLYWW
ALYW
LVX50
ALYW
LVX
50

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MC74LVX50DTG Summary of contents

Page 1

... Designed for 2 3.6 V Operating Range Low Noise 0.5 V (Max) OLP Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 March, 2005 − Rev 3 ...

Page 2

Figure 1. Logic Diagram ...

Page 3

MAXIMUM RATINGS Symbol V DC Supply Voltage Input Voltage Output Voltage OUT I DC Input Diode Current Output Diode Current Output Sink Current OUT I DC Supply Current ...

Page 4

DC ELECTRICAL CHARACTERISTICS Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î ...

Page 5

A t PLH 50 Figure 3. Switching Waveforms EMBOSSED CARRIER DIMENSIONS (See Notes 9 and 10) Tape Size Max 8 mm 4.35 mm 1.5 mm 1.0 mm 1.75 mm (0.179”) + ...

Page 6

K t COVER SEE NOTE 11 FOR MACHINE REFERENCE ONLY INCLUDING DRAFT AND RADII CONCENTRIC AROUND MIN. TAPE AND COMPONENTS SHALL PASS AROUND RADIUS “R” WITHOUT DAMAGE BENDING RADIUS MAXIMUM COMPONENT ROTATION 10 ...

Page 7

MC74LVX50 1.5 mm MIN (0.06”) 20.2 mm MIN A (0.795”) FULL RADIUS Figure 7. Reel Dimensions REEL DIMENSIONS Tape Size T&R Suffix A Max 8 mm T1, T2 178 mm (7” T3, T4 330 mm (13” ...

Page 8

TAPE TRAILER (Connected to Reel Hub) CAVITY TOP TAPE NO COMPONENTS TAPE 160 mm MIN Figure 10. TSSOP and SOIC R2 Reel Configuration/Orientation TAPE UTILIZATION BY PACKAGE Tape Size MC74LVX50 COMPONENTS DIRECTION ...

Page 9

G −T− SEATING 14 PL PLANE 0.25 (0.010 14X REF 0.10 (0.004) 0.15 (0.006 L PIN 1 IDENT. 1 0.15 (0.006) T ...

Page 10

... E L DETAIL P VIEW American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...

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