1104R24M00000AF Vectron International, Inc., 1104R24M00000AF Datasheet - Page 3

• Manufacturer Part Number: 1104R24M00000AF
• Description: IC SMD CRYSTAL OSC. 24MHZ 5V 20FLATPACK
• Manufacturer: Vectron International, Inc.

SIZE
A
3.
3.1
3.2
3.3
3.4
3.4.1 Design. The ruggedized designs implemented for these devices are proven in military
3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by
3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of
3.4.2 Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high
CODE IDENT NO.
00136
GENERAL REQUIREMENTS
Classification. All devices delivered to this specification are of hybrid technology
conforming to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S
equivalent specification, options are imbedded within it to also produce Class B,
Engineering Model and Ruggedized COTS devices. Devices carry a Class 2 ESDS
classification.
Item Identification. External packaging choices are of metal flatpacks, DIP s and
ceramic J-lead 9x14mm and LCC s with either TTL or ACMOS logic output. Unique
Model Number Series are utilized to identify device package configurations and output
logic as listed in Table 1.
Absolute Maximum Ratings.
a. Supply Voltage Range (V
b. Storage Temperature Range (T
c. Junction Temperature (T
d. Lead Temperature (soldering, 10 seconds):
Design, Parts, Materials and Processes, Assembly, Inspection and Test.
and space applications under extreme environments. Designs utilize 4-point crystal
mounting in compliment with Established Reliability (MIL-ER) componentry. When
specified, radiation hardening up to 100krad(Si) (RHA level R) can be included without
altering the device s internal topography.
reselecting passive chip component values to offset component tolerances, there will not
be fundamental changes to the design or assembly or parts, materials and processes after
first product delivery of that item without written approval from the procuring activity.
MIL-PRF-55310. These designs have also passed extended dynamic levels of at least:
reliability devices produced to this specification.
a. Gold metallization of package elements without a barrier metal.
b. Zinc chromate as a finish.
c. Cadmium, zinc, or pure tin external or internal to the device.
d. Plastic encapsulated semiconductor devices.
e. Ultrasonically cleaned electronic parts.
Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)
Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms)
Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)
UNSPECIFIED TOLERANCES
J
):
CC
):
STG
N/A
):
-0.5Vdc to +7.0Vdc
-65°C to +125°C
+175°C
+300°C
OS-68338
DWG NO.
REV.
G
SHEET
3