74LVC244APW,112 NXP Semiconductors, 74LVC244APW,112 Datasheet - Page 2

IC BUFF/DVR TRI-ST DUAL 20TSSOP

74LVC244APW,112

Manufacturer Part Number
74LVC244APW,112
Description
IC BUFF/DVR TRI-ST DUAL 20TSSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC244APW,112

Package / Case
20-TSSOP
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
24mA, 24mA
Voltage - Supply
1.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
LVC
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
40 uA
Low Level Output Current
24 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Output Current
50 mA
Output Type
3-State
Output Voltage
6.5 V
Propagation Delay Time
2.8 ns (Typ) @ 3.3 V
Number Of Lines (input / Output)
8 / 8
Logical Function
Buffer/Line Driver
Number Of Elements
2
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
1.8/2.5/3.3V
Package Type
TSSOP
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.2V
Quiescent Current
40uA
Technology
CMOS
Pin Count
20
Mounting
Surface Mount
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-5001
74LVC244APW
74LVC244APW,112
74LVC244APW
935210420112
NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVC_LVCH244A_6
Product data sheet
Type number
74LVC244AD
74LVCH244AD
74LVC244ADB
74LVCH244ADB
74LVC244APW
74LVCH244APW
74LVC244ABQ
74LVCH244ABQ
74LVC244ABX
74LVCH244ABX
Fig 1.
Logic symbol
Ordering information
Package
Temperature range
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
1OE
1A0
1A1
1A2
1A3
2
4
6
8
1
Name
SO20
SSOP20
TSSOP20
DHVQFN20
DHXQFN20U plastic dual in-line compatible thermal enhanced
Rev. 06 — 13 August 2009
18
16
14
12
1Y0
1Y1
1Y2
1Y3
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced
very thin quad flat package; no leads; 20 terminals;
body 2.5
extremely thin quad flat package; no leads; 20
terminals; UTLP based; body 2.5
2OE
74LVC244A; 74LVCH244A
2A0
2A1
2A2
2A3
17
15
13
11
19
4.5
0.85 mm
3
5
7
9
mna874
2Y0
2Y1
2Y2
2Y3
Octal buffer/line driver; 3-state
4.5
0.5 mm
© NXP B.V. 2009. All rights reserved.
Version
SOT163-1
SOT339-1
SOT360-1
SOT764-1
SOT1045-1
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