74LVT125DB,112 NXP Semiconductors, 74LVT125DB,112 Datasheet - Page 2

• Manufacturer Part Number: 74LVT125DB,112
• Description: IC BUFF TRI-ST QD N-INV 14SSOP
• Manufacturer: NXP Semiconductors
• Series: 74LVTr

Specifications of 74LVT125DB,112

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 4
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SSOP
• Logic Family: LVT
• Number Of Channels Per Chip: 4
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 32 mA
• Low Level Output Current: 64 mA
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 4 / 4
• Output Type: 3-State
• Propagation Delay Time: 2.9 ns at 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74LVT125DB; 74LVT125DB; 935180980112

Philips Semiconductors
4. Ordering information
Table 2.
74LVT_LVTH125_6
Product data sheet
Type number
74LVT125D
74LVT125DB
74LVT125PW
74LVT125BQ
74LVTH125D
74LVTH125DB
74LVTH125PW
74LVTH125BQ
Ordering information
Package
Temperature range Name
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +85 C
Table 1.
GND = 0 V; T
Symbol Parameter
C
C
I
CC
i
o
input capacitance
output capacitance
quiescent supply current
Quick reference data
amb
SO14
SSOP14
TSSOP14
DHVQFN14
SO14
SSOP14
TSSOP14
DHVQFN14
= 25 C.
Rev. 06 — 6 March 2006
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
…continued
Conditions
V
outputs disabled;
V
outputs disabled;
V
I
O
CC
= 0 V or 3.0 V
= 0 V or 3.0 V
3
3
= 3.6 V
74LVT125; 74LVTH125
0.85 mm
0.85 mm
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
3.3 V quad buffer; 3-state
Min
-
-
-
Typ
4
8
0.13
Max
-
-
-
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1
SOT108-1
SOT337-1
SOT402-1
SOT762-1
Unit
pF
pF
mA
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