MAX9134GHJ+ Maxim Integrated Products, MAX9134GHJ+ Datasheet - Page 2

• Manufacturer Part Number: MAX9134GHJ+
• Description: IC SW LVDS CROSSBAR 32TQFP-EP
• Manufacturer: Maxim Integrated Products
• Type: LVDS Crossbar Switchr

Specifications of MAX9134GHJ+

• Applications: Digital Video
• Mounting Type: Surface Mount
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
All Pins to GND .............................................-0.3V to V
Short-Circuit Duration (all outputs).............................Continuous
Continuous Power Dissipation (T
Operating Temperature Range .........................-40°C to +105°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection
Programmable, High-Speed, Multiple
Input/Output LVDS Crossbar Switches
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
20 SSOP-EP
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
DC ELECTRICAL CHARACTERISTICS
(V
= V
2
Supply Voltage
Supply Current
SINGLE-ENDED CMOS INPUTS (PD, FS, RXD)
Input High Level
Input Low Level
Input High Current
SINGLE-ENDED OUTPUTS (TXD, AS1/NSLP)
Output High Level
Output Low Level
3-LEVEL INPUTS (S5–S0, AS0, AS1)
Input High Level
Input Low Level
Input Open Level
Input Current
DD
AVDD
32-Pin TQFP (derate 27.8mW/°C above +70°C)........2222mW
20-Pin TSSOP (derate 26.5mW/°C above +70°C) .....2122mW
Human Body Model (R D = 1.5kΩ, C S = 100pF)
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
LVDSVDD
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +4.0V
All Other Pins Including SCL, SDA to GND .................±2kV
= V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
DVDD
= +3.3V, T
= V
LVDSVDD
A
= +25°C.) (Note 2)
= +3.0V to +3.6V, T
A
= +70°C)
SYMBOL
I
LVDSVDD
I
I
I
L3
AVDD
DVDD
V
V
V
V
V
V
V
V
I
IN1
IO3
DD
IH1
OH
IH3
, I
IL1
OL
IL3
JC
H3
,
,
) ..................2°C/W
JA
) ........37.7°C/W
Outputs switching at
20MHz
V
I
Measured at the input pins
V
A
OL
IN
IL3
= -40°C to +105°C, unless otherwise noted. Typical values are at V
DD
= 0 to V
= 4mA
= 0V or V
+ 0.3V
DD
IH3
CONDITIONS
= V
32 TQFP-EP
IEC 61000-4-2 (R D = 330Ω, C S = 150pF)
ISO 10605 (R D = 2kΩ, C S = 330pF)
Lead Temperature (soldering, 10s) ................................+300°C
Soldering Temperature (reflow) .......................................+260°C
DD
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Contact Discharge
Air-Gap Discharge
Contact Discharge
Air-Gap Discharge
MAX9132
MAX9134/MAX9135
(DIN_, DOUT_) to GND ..............................................±10kV
(DIN_, DOUT_) to GND ..............................................±15kV
(DIN_, DOUT_) to GND ..............................................±10kV
(DIN_, DOUT_) to GND ..............................................±25kV
V
MIN
-20
-20
3.0
2.0
0.4
2.5
1.2
DD
-
TYP
1.45
60
86
JC
) ..................4°C/W
JA
MAX
+20
+20
) ...........36°C/W
100
3.6
0.8
0.4
0.8
1.9
80
AVDD
= V
UNITS
mA
µA
µA
V
V
V
V
V
V
V
V
DVDD