MAX7370 Maxim, MAX7370 Datasheet - Page 2

• Manufacturer Part Number: MAX7370
• Description: The MAX7370 I²C-interfaced peripheral provides microprocessors with management of up to 64 key switches, with optional GPIO and PWM-controlled LED drivers
• Manufacturer: Maxim

with I
ABSOLUTE MAXIMUM RATINGS
V
COL3–COL0, ROW7–ROW0 to GND ....... -0.3V to (V
COL7–COL4 to GND ...............................................-0.3V to +6V
SDA, SCL, AD0, INT to GND ..................................-0.3V to +6V
V
DC Current on COL7–COL4 to GND .................................25mA
DC Current on COL3–COL0, ROW7–ROW0 to GND ...........7mA
V
DC Current V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
24 TQFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
Operating Supply Voltage
Second Logic Supply
Operating Supply Current
Sleep-Mode Supply Current
POR Threshold
KEY-SWITCH SPECIFICATIONS
Key-Switch Source Current
Key-Switch Source Voltage
Key-Switch Resistance
Startup Time from Sleep
GPIO SPECIFICATIONS
External Supply Voltage
COL7–COL4 (LED Drivers)
LED Port-to-Port Sink Current Variation
CC
LA
CC
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
CC
, V
, V
to V
8 x 8 Key-Switch Controller and LED Driver/GPIOs
= 1.62V to 3.6V, T
LA
LA
CC
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
, GND Current .....................................................80mA
to GND ....................................................-0.3V to +4V
...........................................................-0.3V to +2.3V
CC
PARAMETER
2
, V
C Interface and High Level of ESD Protection
LA
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to COL3–COL0, ROW7–ROW0 .........5mA
A
= -40NC to +85NC, unless otherwise noted. Typical values are at V
JC
SYMBOL
) ................5.4°C/W
t
JA
V
START
V
R
V
V
I
V
I
KEY
I
POR
CC
KEY
KEY
LED
) .........65.1°C/W
SL
CC
LA
CC
All key switches open, oscillator
running
N keys pressed
Not using GPO or LED configuration
(Note 4)
V
10mA output mode
+ 0.3V)
CC
= 3.3V, V
CONDITIONS
OL
Continuous Power Dissipation (T
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (TQFN) (soldering, 10s) ...................+300°C
Soldering Temperature (reflow) ......................................+260°C
25 WLP
Junction-to-Ambient Thermal Resistance (B
24-Pin TQFN (derate 15.4mW/°C above +70°C) ......1229mW
25-Bump WLP (derate 19.2mW/°C above +70°C) ......850mW
= 1V, T
A
= +25NC,
CC
1.62
V
MIN
= 3.3V, T
CC
50 + 28 O N
A
= +70°C)
A
TYP
0.45
Q1.5
3.3
3.3
1.8
1.2
50
28
2
= +25NC.) (Notes 2, 3)
MAX7370
JA
MAX
Q2.4
3.6
3.6
0.5
2.7
65
40
3
5
5
) ...........52°C/W
UNITS
kI
ms
FA
FA
FA
%
V
V
V
V
V