STM8SPLNB1 STMicroelectronics, STM8SPLNB1 Datasheet - Page 35

• Manufacturer Part Number: STM8SPLNB1
• Description: DiSEqC slave microcontroller for SaTCR based LNBs and switchers
• Manufacturer: STMicroelectronics

STM8SPLNB1
5.3
5.3.1
Thermal characteristics
The maximum chip junction temperature (T
Table 22: General operating
The maximum chip-junction temperature, T
using the following equation:
T
Where:
●
●
●
●
●
Table 34.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Jmax
environment.
Symbol
T
Θ
P
P
internal power.
P
Where:
P
taking into account the actual V
the application.
Amax
Θ
= T
Dmax
INTmax
I/Omax
I/Omax
JA
JA
is the package junction-to-ambient thermal resistance in ° C/W
Amax
is the maximum ambient temperature in °C
is the sum of P
= Σ (V
represents the maximum power dissipation on output pins
Thermal characteristics
is the product of I
+ (P
Thermal resistance junction-ambient
TSSOP20 - 4.4 mm
Thermal resistance junction-ambient
SO20W - (300 mils)
Thermal resistance junction-ambient
UFQFPN20 - 3 x 3 mm
OL
Dmax
*I
OL
x Θ
) + Σ((V
INTmax
JA
conditions.
Doc ID 018831 Rev 3
)
DD
DD
and P
and V
Parameter
-V
OL
OH)
(1)
/I
I/Omax
DD
OL and
*I
, expressed in Watts. This is the maximum chip
OH
Jmax
Jmax
),
(P
V
) must never exceed the values given in
, in degrees Celsius, may be calculated
OH
Dmax
/I
OH
= P
of the I/Os at low and high level in
INTmax
+ P
I/Omax
Package information
Value
84
91
90
)
°C/W
Unit
35/43