STTH312 STMicroelectronics, STTH312 Datasheet - Page 6

• Manufacturer Part Number: STTH312
• Description: Ultrafast recovery - 1200 V diode
• Manufacturer: STMicroelectronics

Package mechanical data
2
6/8
Package mechanical data
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Table 5.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
H
L4
Figure 13. DPAK footprint (dimensions in mm)
DPAK dimensions
0.60 MIN.
B2
E
G
B
6.7
L2
A2
V2
A1
R
6.7
C2
A
C
R
3
D
REF.
C2
A1
A2
B2
V2
L2
L4
3
G
A
B
C
D
E
H
1.6
1.6
Min.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
0.60
0°
Millimeters
0.80 typ.
2.3
2.3
10.10
DIMENSIONS
Max
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
1.00
8°
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
0.023
Min.
0°
0.031 typ.
Inches
STTH312
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
0.039
Max.
8°