STTH812 STMicroelectronics, STTH812 Datasheet - Page 9
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STTH812
Manufacturer Part Number
STTH812
Description
Ultrafast recovery -1200 V diode
Manufacturer
STMicroelectronics
Datasheet
1.STTH812.pdf
(11 pages)
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STTH812
Table 8.
Figure 14. D
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
L
L2
L3
D
2
2
PAK dimensions
PAK footprint (dimensions in mm)
E
G
B2
B
10.30
* FLAT ZONE NO LESS THAN 2mm
A1
C2
M
C
A2
*
A
8.90
R
V2
16.90
D
REF.
C2
A1
A2
B2
L2
L3
V2
C
D
G
M
R
3.70
A
B
E
L
10.00
15.00
Min.
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
4.88
1.27
1.40
2.40
0°
Millimeters
1.30
0.40 typ.
Package mechanical data
10.40
15.85
5.08
DIMENSIONS
Max
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
5.28
1.40
1.75
3.20
8°
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
Min.
0°
0.016 typ.
Inches
Max.
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.126
8°
9/11