BLA6G1011-200R NXP Semiconductors, BLA6G1011-200R Datasheet
BLA6G1011-200R
Available stocks
Related parts for BLA6G1011-200R
BLA6G1011-200R Summary of contents
Page 1
... BLA6G1011-200R; BLA6G1011L(S)-200RG Power LDMOS transistor Rev. 4 — 9 November 2011 1. Product profile 1.1 General description 200 W LDMOS power transistor for avionics applications at frequencies from 1030 MHz to 1090 MHz. Table 1. Typical RF performance at T Test signal Typical RF performance in a class-AB production test circuit for SOT502A ...
Page 2
... NXP Semiconductors 2. Pinning information Table 2. Pin BLA6G1011-200R (SOT502A BLA6G1011L-200RG (SOT502D BLA6G1011LS-200RG (SOT502C [1] Connected to flange. 3. Ordering information Table 3. Type number BLA6G1011-200R BLA6G1011L-200RG BLA6G1011LS-200RG - 4. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V DS ...
Page 3
... All information provided in this document is subject to legal disclaimers. Rev. 4 — 9 November 2011 Power LDMOS transistor Type = 25 C; BLA6G1011-200R case = 50 s; BLA6G1011L-200RG BLA6G1011LS-200RG 0.065 K/W Conditions Min 0 ...
Page 4
... NXP Semiconductors 6.1 Ruggedness in class-AB operation The BLA6G1011-200R, BLA6G1011L-200RG and BLA6G1011LS-200RG are enhanced rugged devices and are capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions Application information 7.1 Impedance information Table 8. Typical values unless otherwise specified. ...
Page 5
... ( 1030 MHz ( 1060 MHz ( 1090 MHz Fig 4. Drain efficiency as a function of load power; typical values BLA6G1011-200R_L-200RG_LS-200RG Product data sheet BLA6G1011(L)(S)-200R(G) 001aak266 ( 100 mA. Dq Fig 3. 001aak268 G RL (dB) ...
Page 6
... NXP Semiconductors 7.3 Application circuit Remark: For BLA6G1011-200R with straight leads C2 C1 See Table 9 for list of components. Fig 6. Component layout for class-AB application circuit Table 9. See Figure Striplines are on a Rogers Duroid 6010 Printed-Circuit Board (PCB); thickness = 0.64 mm Component Description C1 C5, C8 ...
Page 7
... DIMENSIONS (millimetre dimensions are derived from the original inch dimensions UNIT 4.72 12.83 20.02 0.15 mm 3.43 12.57 0.08 19.61 0.186 0.505 0.006 0.788 inches 0.495 0.135 0.003 0.772 OUTLINE VERSION IEC SOT502A Fig 7. Package outline SOT502A BLA6G1011-200R_L-200RG_LS-200RG Product data sheet BLA6G1011(L)(S)-200R( scale 19.96 9.50 9.53 1.14 19.94 5 ...
Page 8
... Note 1. Millimeter dimensions are derived from the original inch dimensions. Outline version IEC SOT502C Fig 8. Package outline SOT502C BLA6G1011-200R_L-200RG_LS-200RG Product data sheet BLA6G1011(L)(S)-200R( scale ...
Page 9
... Note 1. Millimeter dimensions are derived from the original inch dimensions. Outline version IEC SOT502D Fig 9. Package outline SOT502D BLA6G1011-200R_L-200RG_LS-200RG Product data sheet BLA6G1011(L)(S)-200R( scale ...
Page 10
... Abbreviations Table 10. Acronym LDMOS LDMOST RF SMD VSWR 11. Revision history Table 11. Revision history Document ID BLA6G1011-200R_L-200RG_LS-200RG V.4 20111109 Modifications: BLA6G1011-200R v.3 BLA6G1011-200R_L-200RG_LS-200RG Product data sheet BLA6G1011(L)(S)-200R(G) Abbreviations Description Laterally Diffused Metal-Oxide Semiconductor Laterally Diffused Metal-Oxide Semiconductor Transistor Radio Frequency Surface Mounted Device Voltage Standing-Wave Ratio ...
Page 11
... This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BLA6G1011-200R_L-200RG_LS-200RG Product data sheet BLA6G1011(L)(S)-200R(G) [3] Definition This document contains data from the objective specification for product development ...
Page 12
... Contact information For more information, please visit: For sales office addresses, please send an email to: BLA6G1011-200R_L-200RG_LS-200RG Product data sheet BLA6G1011(L)(S)-200R(G) NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
Page 13
... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BLA6G1011-200R_L-200RG_LS-200RG All rights reserved. Date of release: 9 November 2011 ...