PSMN3R3-80ES NXP Semiconductors, PSMN3R3-80ES Datasheet - Page 2
PSMN3R3-80ES
Manufacturer Part Number
PSMN3R3-80ES
Description
Standard level N-channel MOSFET in I2PAK package qualified to 175C
Manufacturer
NXP Semiconductors
Datasheet
1.PSMN3R3-80ES.pdf
(14 pages)
NXP Semiconductors
2. Pinning information
Table 2.
3. Ordering information
Table 3.
4. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
PSMN3R3-80ES
Product data sheet
Pin
1
2
3
mb
Type number
PSMN3R3-80ES
Symbol
V
V
V
I
I
P
T
T
T
Source-drain diode
I
I
Avalanche ruggedness
E
D
DM
S
SM
stg
j
sld(M)
DS
DGR
GS
tot
DS(AL)S
Continuous current is limited by package.
Symbol Description
G
D
S
D
Pinning information
Ordering information
Limiting values
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
peak drain current
total power dissipation
storage temperature
junction temperature
peak soldering temperature
source current
peak source current
non-repetitive drain-source
avalanche energy
gate
drain
source
drain
Package
Name
I2PAK
Description
plastic single-ended package (I2PAK); TO-262
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 October 2011
Simplified outline
Conditions
T
T
V
V
pulsed; t
see
T
T
pulsed; t
V
V
j
j
mb
mb
GS
GS
GS
sup
≥ 25 °C; T
≥ 25 °C; T
N-channel 80 V, 3.3 mΩ standard level MOSFET in I2PAK
Figure 3
= 25 °C; see
= 25 °C
= 10 V; T
= 10 V; T
= 10 V; T
≤ 80 V; R
SOT226 (I2PAK)
p
p
≤ 10 µs; T
≤ 10 µs; T
1
j
j
mb
≤ 175 °C
≤ 175 °C; R
2
mb
mb
j(init)
GS
3
= 100 °C; see
= 25 °C; see
= 50 Ω; unclamped
Figure 2
= 25 °C; I
mb
mb
= 25 °C;
= 25 °C
GS
D
= 20 kΩ
= 120 A;
Figure 1
Graphic symbol
Figure 1
PSMN3R3-80ES
[1]
[1]
[1]
mbb076
G
Min
-
-
-20
-
-
-
-
-55
-55
-
-
-
-
© NXP B.V. 2011. All rights reserved.
D
S
SOT226
175
175
Version
Max
80
80
20
120
120
830
338
260
120
830
676
Unit
V
V
V
A
A
A
W
°C
°C
°C
A
A
mJ
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