NUP1301U NXP Semiconductors, NUP1301U Datasheet - Page 3

• Manufacturer Part Number: NUP1301U
• Description: Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a smallSOT323 (SC-70) Surface-Mounted Device (SMD) plastic package designed toprotect one signal line in rail-to-rail configuration from the damage caused byESD and other transie
• Manufacturer: NXP Semiconductors

NXP Semiconductors
NUP1301U
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
Table 6.
[1]
[2]
Table 7.
Symbol
Per device
P
T
T
Symbol
V
Standard
IEC 61000-4-2; level 4 (ESD)
MIL-STD-883; class 3B (human body model)
I
P
T
PP
j
amb
stg
PP
tot
ESD
Pulse test: t
T
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).
Single diode loaded.
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device stressed with ten non-repetitive ESD pulses.
Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).
j
= 25 C prior to surge.
Parameter
electrostatic discharge
voltage
Limiting values
ESD maximum ratings
ESD standards compliance
Parameter
peak pulse power
peak pulse current
total power dissipation
junction temperature
ambient temperature
storage temperature
p
 300 s;   0.02.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 January 2011
…continued
Conditions
t
t
T
p
p
amb
Conditions
IEC 61000-4-2
(contact discharge)
machine model
MIL-STD-883
(human body model)
= 8/20 s
= 8/20 s
 25 C
Ultra low capacitance ESD protection array
Conditions
> 15 kV (air); > 8 kV (contact)
> 8 kV
[3][4]
[3][4]
[5][6]
[1][2]
Min
-
-
-
-
55
65
Min
-
-
-
NUP1301U
© NXP B.V. 2011. All rights reserved.
Max
220
11
200
150
+150
+150
Max
30
400
10
Unit
W
A
mW
C
C
C
Unit
kV
V
kV
3 of 14