NUP1301U NXP Semiconductors, NUP1301U Datasheet - Page 10

Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a smallSOT323 (SC-70) Surface-Mounted Device (SMD) plastic package designed toprotect one signal line in rail-to-rail configuration from the damage caused byESD and other transie

NUP1301U

Manufacturer Part Number
NUP1301U
Description
Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a smallSOT323 (SC-70) Surface-Mounted Device (SMD) plastic package designed toprotect one signal line in rail-to-rail configuration from the damage caused byESD and other transie
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NUP1301U
Manufacturer:
NXP
Quantity:
20 000
NXP Semiconductors
12. Soldering
NUP1301U
Product data sheet
Fig 10. Reflow soldering footprint SOT323 (SC-70)
Fig 11. Wave soldering footprint SOT323 (SC-70)
3.65 2.1
2.35
(3×)
0.6
All information provided in this document is subject to legal disclaimers.
1.425
(3×)
0.55
(3×)
Rev. 1 — 28 January 2011
3
2.65
1.85
2.575
4.6
1.325
2
1
(3×)
0.5
Ultra low capacitance ESD protection array
1.3
(2×)
09
1.8
Dimensions in mm
NUP1301U
direction during soldering
Dimensions in mm
© NXP B.V. 2011. All rights reserved.
preferred transport
solder lands
solder resist
solder paste
occupied area
sot323_fr
solder lands
solder resist
occupied area
sot323_fw
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