BAS16_SER NXP Semiconductors, BAS16_SER Datasheet - Page 5

• Manufacturer Part Number: BAS16_SER
• Description: High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
BAS16_SER_5
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Table 7.
Symbol
Per device
T
T
T
Symbol
R
R
j
amb
stg
th(j-a)
th(j-t)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB with 60 m copper strip line.
Single diode loaded.
T
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering points at pins 4, 5 and 6.
j
= 25 C prior to surge.
Limiting values
Thermal characteristics
Parameter
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to tie-point
BAS16
BAS16H
BAS16J
BAS16L
BAS16VV
BAS16W
BAS16
BAS16W
Rev. 05 — 25 August 2008
…continued
Conditions
Conditions
in free air
[2][3]
[3][4]
[3][4]
[2][3]
[2][3]
[3][4]
High-speed switching diodes
[1]
[5]
[5]
[1]
BAS16 series
Min
-
-
-
-
-
-
-
-
-
-
Min
-
65
65
Typ
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2008. All rights reserved.
Max
150
+150
+150
Max
500
330
150
230
500
700
410
625
330
300
Unit
2
C
C
C
.
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
5 of 20