BAS16_SER NXP Semiconductors, BAS16_SER Datasheet - Page 13

no-image

BAS16_SER

Manufacturer Part Number
BAS16_SER
Description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 21. Reflow soldering footprint BAS16L (SOD882)
Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75)
0.9
Reflow soldering is the only recommended soldering method.
0.85
(2 )
(2 )
0.3
0.4
(3 )
0.6
Rev. 05 — 25 August 2008
1.3
0.7
2.2
1.3
1.7
(2 )
0.6
R0.05 (8 )
(3 )
0.5
(2 )
0.7
1
2
High-speed switching diodes
BAS16 series
Dimensions in mm
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot416_fr
sod882_fr
13 of 20

Related parts for BAS16_SER