BAT960 NXP Semiconductors, BAT960 Datasheet - Page 3

• Manufacturer Part Number: BAT960
• Description: Planar Schottky barrier diode with an integrated guard ringfor stress protection in a SOT666 ultra small SMD plasticpackage
• Manufacturer: NXP Semiconductors

NXP Semiconductors
THERMAL CHARACTERISTICS
Notes
1. Refer to SOT666 standard mounting conditions.
2. Mounted on printed circuit-board, 1 cm
Soldering
The only recommended soldering method is reflow soldering.
CHARACTERISTICS
T
Notes
1. Only valid, if pins 1, 2, 5 and 6 are soldered on a 1 cm
2. Pulse test: t
2003 May 01
R
V
I
C
SYMBOL
SYMBOL
amb
R
F
Schottky barrier diode
th j-a
d
= 25 °C unless otherwise specified.
thermal resistance from junction to ambient
continuous forward voltage
reverse current
diode capacitance
p
= 300 μs; δ = 0.02.
PARAMETER
PARAMETER
2
copper area.
I
I
I
V
V
V
V
F
F
F
R
R
R
R
= 10 mA
= 100 mA
= 1 000 mA; note 1; see Fig.2
= 5 V; note 2
= 8 V; note 2
= 15 V; note 2; see Fig.3
= 5 V; f = 1 MHz; see Fig.4
2
3
copper solder land.
CONDITIONS
note 1
note 2
CONDITIONS
240
300
480
5
7
10
19
TYP.
VALUE
405
215
270
350
550
10
20
50
25
MAX.
Product data sheet
BAT960
UNIT
K/W
K/W
mV
mV
mV
μA
μA
μA
pF
UNIT