BYQ28ED-200 NXP Semiconductors, BYQ28ED-200 Datasheet - Page 3

• Manufacturer Part Number: BYQ28ED-200
• Manufacturer: NXP Semiconductors

NXP Semiconductors
5. Thermal characteristics
Table 4.
[1]
BYQ28_SER_E_ED_4
Product data sheet
Symbol
R
R
Fig 1. Transient thermal impedance from junction to mounting base as a function of pulse width
th(j-mb)
th(j-a)
Z
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
(K/W)
th(j-mb)
10
10
10
10
1
1
2
3
10
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to ambient in free air; SOT78
6
Thermal characteristics
10
5
10
4
Rev. 04 — 5 December 2007
10
3
Conditions
with heatsink compound;
per diode; see
with heatsink compound;
both diodes conducting
SOT428
10
BYQ28 series E and ED
2
Figure 1
10
Rectifier diodes ultrafast, rugged
1
[1]
Min
-
-
-
-
P
1
Typ
-
-
60
50
t
p
T
© NXP B.V. 2007. All rights reserved.
t
p
001aag979
(s)
Max
4.5
3
-
-
=
T
t
t
p
10
Unit
K/W
K/W
K/W
K/W
3 of 10