TDF8599A NXP Semiconductors, TDF8599A Datasheet - Page 48

• Manufacturer Part Number: TDF8599A
• Description: The TDF8599A is a dual Bridge-Tied Load (BTL) car audio amplifier comprising anNDMOST-NDMOST output stage based on SOI BCDMOS technology
• Manufacturer: NXP Semiconductors

NXP Semiconductors
TDF8599A_2
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 23.
Table 24.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 23
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
24
52.
Rev. 02 — 30 June 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
I
2
C-bus controlled dual channel class-D power amplifier
3
3
)
)
Figure
350 to 2000
260
250
245
52) than a SnPb process, thus
220
220
350
TDF8599A
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
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