SA58672 NXP Semiconductors, SA58672 Datasheet - Page 27

• Manufacturer Part Number: SA58672
• Manufacturer: NXP Semiconductors

NXP Semiconductors
20. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
12
12.1
13
14
14.1
14.2
14.3
14.4
15
15.1
15.2
15.3
15.3.1
15.3.2
15.3.3
15.3.4
16
17
18
18.1
18.2
18.3
18.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Typical characterization curves . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Soldering of SMD packages . . . . . . . . . . . . . . 20
Soldering of WLCSP packages. . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Power supply decoupling considerations . . . . 13
Voltage gain . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Input capacitor selection . . . . . . . . . . . . . . . . . 13
PCB layout considerations . . . . . . . . . . . . . . . 14
Evaluation demo board. . . . . . . . . . . . . . . . . . 14
Filter-free operation and ferrite bead filters. . . 15
Efficiency and thermal considerations . . . . . . 16
Additional thermal information . . . . . . . . . . . . 16
Test setup for typical characterization curves . 17
Introduction to soldering . . . . . . . . . . . . . . . . . 20
Wave and reflow soldering . . . . . . . . . . . . . . . 20
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21
Introduction to soldering WLCSP packages . . 22
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Quality of solder joint . . . . . . . . . . . . . . . . . . . 24
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.0 W mono class-D audio amplifier
Document identifier: SA58672_4
SA58672
Date of release: 8 June 2009
All rights reserved.