SA58672 NXP Semiconductors, SA58672 Datasheet - Page 22

• Manufacturer Part Number: SA58672
• Manufacturer: NXP Semiconductors

NXP Semiconductors
15. Soldering of WLCSP packages
SA58672_4
Product data sheet
15.1 Introduction to soldering WLCSP packages
15.2 Board mounting
15.3 Reflow soldering
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description” .
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
Board mounting of a WLCSP requires several steps:
Key characteristics in reflow soldering are:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
Fig 18. Temperature profiles for large and small components
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
temperature
MSL: Moisture Sensitivity Level
Rev. 04 — 8 June 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Figure
3.0 W mono class-D audio amplifier
19) than a PbSn process, thus
temperature
peak
SA58672
© NXP B.V. 2009. All rights reserved.
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