LTC1540IS8#PBF Linear Technology, LTC1540IS8#PBF Datasheet - Page 10
![IC COMP NANOPOWER W/REF 8-SOIC](/photos/7/4/70430/ltc1540is8_pbf_sml.jpg)
LTC1540IS8#PBF
Manufacturer Part Number
LTC1540IS8#PBF
Description
IC COMP NANOPOWER W/REF 8-SOIC
Manufacturer
Linear Technology
Type
with Voltage Referencer
Datasheet
1.LTC1540CS8PBF.pdf
(12 pages)
Specifications of LTC1540IS8#PBF
Number Of Elements
1
Output Type
CMOS, TTL
Voltage - Supply
2 V ~ 11 V, ±1 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Comparator Type
General Purpose
No. Of Comparators
1
Response Time
50µs
Ic Output Type
CMOS, MOS, Open-Collector / Drain, TTL
Supply Current
300nA
Supply Voltage Range
± 1V To ± 5.5V
Rohs Compliant
Yes
Output Compatibility
CMOS, TTL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE
LTC1540
10
(.0165 ± .0015)
3.5 ±0.05
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.42 ± 0.04
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
TYP
2.15 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
0.28 ± 0.05
DESCRIPTION
2.38 ±0.05
(2 SIDES)
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
0.65
BSC
3.2 – 3.45
0.50
BSC
U
0.675 ±0.05
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1660)
GAUGE PLANE
(.077)
0.18
TOP MARK
8-Lead Plastic MSOP
PIN 1
0.200 REF
DD Package
MS8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
(.010)
0.254
DETAIL “A”
DETAIL “A”
0° – 6° TYP
(.021 ± .006)
0.53 ± 0.015
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
SEATING
PLANE
0.00 – 0.05
(1.93 ± .006)
(.118 ± .004)
3.00 ± 0.102
4.90 ± 0.15
(.009 – .015)
0.22 – 0.38
(NOTE 3)
1.65 ± 0.10
(2 SIDES)
TYP
(.043)
MAX
1.10
BOTTOM VIEW—EXPOSED PAD
0.28 ± 0.05
(.0256)
R = 0.115
0.65
BSC
1
8
TYP
4
5
7 6 5
2 3
2.38 ±0.10
(2 SIDES)
4
8
3.00 ± 0.102
(.118 ± .004)
1
0.50 BSC
(.206)
(.034)
0.52
REF
NOTE 4
0.86
REF
(.005 ± .003)
0.13 ± 0.076
0.38 ± 0.10
sn1540 1540fas
MSOP (MS8) 0802
(DD8) DFN 0203