BU9253AS Rohm Semiconductor, BU9253AS Datasheet - Page 14

• Manufacturer Part Number: BU9253AS
• Description: IC KARAOKE ECHO SGL CHIP SDIP18
• Manufacturer: Rohm Semiconductor
• Type: Echo ICr

Specifications of BU9253AS

• Applications: Karaoke
• Mounting Type: Through Hole
• Package / Case: 18-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

●Cautions on Use
1)
2)
3)
4)
5)
6)
7)
8)
9)
10) Ground wiring pattern
11) External capacitor
Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
Operating conditions
Characteristics are guaranteed under the conditions of each specified parameter.
Reverse polarity connection of the power supply
Power supply line
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks.
GND voltage
Short circuit between terminals and GND or other devices
Operation in a strong electromagnetic field
Using the ICs in a strong electromagnetic field can cause operation malfunction.
Inspection with set PCB
Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and breakdown of the
input terminal. Therefore, pay thorough attention not to apply a voltage lower than the GND to the input terminals.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition,
even if the power supply voltage is applied, apply a voltage lower than the power supply voltage to the input terminals, or
a voltage within the guaranteed value of electrical characteristics.
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating
voltage on the power ground line may damage the device.
When using external ceramic capacitors, consider degradation in the nominal capacitance value due to DC bias and
changes in the capacitance with temperature.
Connecting the of power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines.
An external direction diode can be added.
Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal.
When applying electrolytic capacitors in the circuit, note that capacitance characteristic values are reduced at low
temperatures.
Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals (except SWOUT)
should be lower than the GND potential voltage including an electric transients.
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
During testing, turn on or off the power before mounting or dismounting the board from the test Jig.
Do not power up the board without waiting for the output capacitors to discharge. The capacitors in the low output impedance
terminal can stress the device. Pay attention to the electro static voltages during IC handling, transportation, and storage.
14/16