ADP5585 Analog Devices, ADP5585 Datasheet - Page 36

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ADP5585

Manufacturer Part Number
ADP5585
Description
Keypad Decoder and I/O Expansion
Manufacturer
Analog Devices
Datasheet

Specifications of ADP5585

Vin Range
1.8 to 3.0V
Application
Mobil I-0 Exp-Keybd Cont,Mobil I-O Expander
Qwerty Keypad
Yes
Other Functions
I2C I/O & register
Function Flag
Mobil I-O
Package
16-Lead WLCSP

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Quantity
Price
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ADP5585
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADP5585ACBZ-00-R7
ADP5585ACBZ-01-R7
ADP5585ACBZ-02-R7
ADP5585ACPZ-00-R7
ADP5585ACPZ-01-R7
ADP5585ACPZ-03-R7
ADP5585CP-EVALZ
1
I
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
2
Z = RoHS Compliant Part.
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
1
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
INDICATOR
SEATING
PLANE
0.80
0.75
0.70
PIN 1
IDENTIFIER
SEATING
0.545
0.500
0.455
PLANE
BALL 1
D09841-0-10/11(A)
Figure 29. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Figure 28. 16-Ball Wafer Level Chip Scale Package [WLCSP]
TOP VIEW
3.10
3.00 SQ
2.90
(BALL SIDE DOWN)
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
TOP VIEW
Package Description
16-Ball Wafer Level Chip Scale Package [WLCSP]
16-Ball Wafer Level Chip Scale Package [WLCSP]
16-Ball Wafer Level Chip Scale Package [WLCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
LFCSP Evaluation Board
1.630
1.590 SQ
1.550
SIDE VIEW
3 x 3 mm Body, Very Very Thin Quad
0.300
0.260
0.220
Dimensions shown in millimeters
Dimensions shown in millimeters
Rev. A | Page 36 of 36
0.20 REF
(CB-16-10)
(CP-16-22)
0.50
0.40
0.30
BSC
0.50
0.05 MAX
0.02 NOM
COPLANARITY
0.05
COPLANARITY
0.230
0.200
0.170
0.40
REF
1.20
REF
0.08
12
9
0.30
0.23
0.18
13
8
BOTTOM VIEW
EXPOSED
4
PAD
BOTTOM VIEW
(BALL SIDE UP)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
3
16
5
2
1
4
1
0.25 MIN
B
D
A
C
1.75
1.60 SQ
1.45
Package Option
CB-16-10
CB-16-10
CB-16-10
CP-16-22
CP-16-22
CP-16-22
CP-16-22
Data Sheet
Branding
LJM
LJN
LJP

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