AD5544 Analog Devices, AD5544 Datasheet - Page 28

• Manufacturer Part Number: AD5544
• Description: Quad, Current-Output, Serial-Input 16-/14-Bit DACs
• Manufacturer: Analog Devices

Specifications of AD5544

• Resolution (bits): 16bit
• Dac Update Rate: 500kSPS
• Dac Settling Time: 0.9µs
• Max Pos Supply (v): +5.5V
• Single-supply: Yes
• Dac Type: Current Out
• Dac Input Format: Ser,SPI

AD5544/AD5554
ORDERING GUIDE
Model
AD5544ARS
AD5544ARSZ
AD5544ARSZ-REEL7
AD5544BRSZ
AD5544BRSZ-REEL7
AD5544ACPZ-1-R2
AD5544ACPZ-1-RL7
AD5544BCPZ-R2
AD5544BCPZ-RL7
AD5554BRSZ
EVAL-AD5544SDZ
1
I
©2000–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
2
Z = RoHS Compliant Part.
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
1
RES Bit
16
16
16
16
16
16
16
16
16
14
INL LSB
±2
±2
±2
±1
±1
±4
±4
±1
±1
±0.5
D00943-0-1/12(F)
DNL LSB
±1.5
±1.5
±1.5
±1
±1
±1
±1
±1
±1
±1
Temperature
Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Rev. F | Page 28 of 28
Package Description
28-Lead Shrink Small Outline Package [SSOP]
28-Lead Shrink Small Outline Package [SSOP]
28-Lead Shrink Small Outline Package [SSOP]
28-Lead Shrink Small Outline Package [SSOP]
28-Lead Shrink Small Outline Package [SSOP]
32-Lead LFCSP_WQ
32-Lead LFCSP_WQ
32-Lead LFCSP_WQ
32-Lead LFCSP_WQ
28-Lead Shrink Small Outline Package [SSOP]
Evaluation Board
Data Sheet
Package
Option
RS-28
RS-28
RS-28
RS-28
RS-28
CP-32-11
CP-32-11
CP-32-11
CP-32-11
RS-28