AD7687 Analog Devices, AD7687 Datasheet - Page 7

no-image

AD7687

Manufacturer Part Number
AD7687
Description
Manufacturer
Analog Devices
Datasheet

Specifications of AD7687

Resolution (bits)
16bit
# Chan
1
Sample Rate
250kSPS
Interface
Ser,SPI
Analog Input Type
Diff-Uni
Ain Range
(2Vref) p-p
Adc Architecture
SAR
Pkg Type
CSP,SOP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD7687BERMZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD7687BRMZ
Manufacturer:
ADI
Quantity:
1 000
Part Number:
AD7687BRMZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD7687BRMZ
Quantity:
10
Company:
Part Number:
AD7687BRMZ
Quantity:
2 000
Part Number:
AD7687BRMZ-REEL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD7687BRMZ-RL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD7687BRMZRL7
Manufacturer:
ADI
Quantity:
1 000
Part Number:
AD7687BRMZRL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Analog Inputs
Supply Voltages
Storage Temperature Range
Junction Temperature
Lead Temperature Range
1
See the Analog Input section.
IN+
REF
VDD, VIO to GND
VDD to VIO
Digital Inputs to GND
Digital Outputs to GND
1
, IN−
1
Rating
GND − 0.3 V to VDD + 0.3 V
or ±130 mA
GND − 0.3 V to VDD + 0.3 V
−0.3 V to +7 V
±7 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
JEDEC J-STD-20
30% VIO
1
2
2V IF VIO ABOVE 2.5V, VIO – 0.5V IF VIO BELOW 2.5V.
0.8V IF VIO ABOVE 2.5V, 0.5V IF VIO BELOW 2.5V.
t
DELAY
TO SDO
Figure 3. Load Circuit for Digital Interface Timing
2V OR VIO – 0.5V
0.8V OR 0.5V
Figure 4. Voltage Levels for Timing
50pF
C
L
Rev. B | Page 7 of 28
500μA
500μA
2
1
I
I
OL
OH
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
10-Lead QFN (LFCSP)
10-Lead MSOP
ESD CAUTION
70% VIO
JA
is specified for the worst-case conditions, that is, a device
t
DELAY
2V OR VIO – 0.5V
0.8V OR 0.5V
1.4V
2
1
θ
84
200
JA
θ
2.96
44
JC
AD7687
Unit
°C/W
°C/W

Related parts for AD7687