TFA9842J/N1,112 NXP Semiconductors, TFA9842J/N1,112 Datasheet - Page 21

• Manufacturer Part Number: TFA9842J/N1,112
• Description: IC AMP AUDIO PWR 15W STER 9SIL
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TFA9842J/N1,112

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Package / Case: 9-SIL (Bent and Staggered Leads)
• Max Output Power X Channels @ Load: 15W x 1 @ 8 Ohm; 7.5W x 2 @ 4 Ohm
• Voltage - Supply: 9 V ~ 26 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Product: Class-AB
• Output Power: 7.5 W, 15 W
• Available Set Gain: 26 dB, 32 dB
• Thd Plus Noise: 0.1 %, 0.05 %
• Operating Supply Voltage: 17 V
• Supply Current: 60 mA
• Maximum Power Dissipation: 35 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 26 V
• Supply Voltage (min): 9 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3453-5; 935274136112; TFA9842J

Philips Semiconductors
Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.3
8.4
8.5
9
10
11
12
13
13.1
13.1.1
13.1.2
13.2
14
14.1
15
16
16.1
16.2
16.3
16.4
17
18
19
20
© Koninklijke Philips Electronics N.V. 2004.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 26 April 2004
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Input configuration . . . . . . . . . . . . . . . . . . . . . . 4
Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4
Output power measurement . . . . . . . . . . . . . . . 5
Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
Supply voltage ripple rejection . . . . . . . . . . . . . 6
Built-in protection circuits . . . . . . . . . . . . . . . . . 6
Printed-circuit board . . . . . . . . . . . . . . . . . . . . 14
Layout and grounding . . . . . . . . . . . . . . . . . . . 14
Power supply decoupling . . . . . . . . . . . . . . . . 15
Thermal behavior and heatsink calculation . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 16
Introduction to soldering through-hole
Soldering by dipping or by solder wave . . . . . 18
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18
Package related soldering information . . . . . . 18
mount packages . . . . . . . . . . . . . . . . . . . . . . 18
Document order number: 9397 750 12013
2-channel audio amplifier (2 x SE or 1 x BTL)
TFA9842J