TDA8552T/N1,512 NXP Semiconductors, TDA8552T/N1,512 Datasheet - Page 5

• Manufacturer Part Number: TDA8552T/N1,512
• Description: IC AMP AUDIO PWR 1.4W AB 20SOIC
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA8552T/N1,512

• Output Type: 2-Channel (Stereo)
• Package / Case: 20-SOIC (7.5mm Width)
• Max Output Power X Channels @ Load: 1.4W x 2 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 1.4 W
• Available Set Gain: 30 dB
• Thd Plus Noise: 0.1 %, 0.04 %
• Operating Supply Voltage: 5 V
• Supply Current: 14 mA
• Maximum Power Dissipation: 2200 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 32 Ohms
• Input Signal Type: Single
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Headphone/Speaker
• Single Supply Voltage (typ): 5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 2.2W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3478-5; 935261315512; TDA8552TD

NXP Semiconductors
PINNING
Note
1. For the SO20 (SOT163-1) package only: the ground
2002 Jan 04
GND1
OUT2+
V
HPS
MODE
UP/DOWN1
UP/DOWN2
V
OUT2−
GND2
GND3
OUT1+
V
GAINSEL
IN2
SVR
IN1
V
OUT1−
GND4
DD1
DD2
DD3
DD4
2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
SYMBOL
pins 1, 10, 11 and 20 are mechanically connected to
the leadframe and electrically to the substrate of the
die. On the PCB the ground pins can be connected to
a copper area to decrease the thermal resistance.
PIN
10
12
13
14
15
16
17
18
19
20
11
1
2
3
4
5
6
7
8
9
(1)
ground 1, substrate/leadframe
positive loudspeaker terminal
output channel 2
supply voltage 1
digital input for headphone
sensing
digital trinary input for mode
selection (standby, mute and
operating)
digital trinary input for volume
control channel 1
digital trinary input for volume
control channel 2
supply voltage 2
negative loudspeaker terminal
output channel 2
ground 2, substrate/leadframe
ground 3, substrate/leadframe
positive loudspeaker terminal
output channel 1
supply voltage 3
digital input for gain selection
audio input channel 2
half supply voltage, decoupling
ripple rejection
audio input channel 1
supply voltage 4
negative loudspeaker terminal
output channel 1
ground 4, substrate/leadframe
DESCRIPTION
5
handbook, halfpage
UP/DOWN1
UP/DOWN2
OUT2
OUT2
MODE
GND1
GND2
V DD1
V DD2
HPS
Fig.2 Pin configuration.
TDA8552T; TDA8552TS
10
1
2
3
4
5
6
7
8
9
TDA8552T
MGM610
15
14
13
12
20
19
18
17
16
11
Product specification
GND4
OUT1
V DD4
IN1
SVR
IN2
GAINSEL
V DD3
OUT1
GND3