TDA8552T/N1,512 NXP Semiconductors, TDA8552T/N1,512 Datasheet - Page 15

• Manufacturer Part Number: TDA8552T/N1,512
• Description: IC AMP AUDIO PWR 1.4W AB 20SOIC
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA8552T/N1,512

• Output Type: 2-Channel (Stereo)
• Package / Case: 20-SOIC (7.5mm Width)
• Max Output Power X Channels @ Load: 1.4W x 2 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
• Mounting Type: Surface Mount
• Product: Class-AB
• Output Power: 1.4 W
• Available Set Gain: 30 dB
• Thd Plus Noise: 0.1 %, 0.04 %
• Operating Supply Voltage: 5 V
• Supply Current: 14 mA
• Maximum Power Dissipation: 2200 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 32 Ohms
• Input Signal Type: Single
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Headphone/Speaker
• Single Supply Voltage (typ): 5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 2.2W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3478-5; 935261315512; TDA8552TD

NXP Semiconductors
Test conditions
T
f = 1 kHz, R
22 Hz to 22 kHz. The thermal resistance (in standard print,
without extra copper) = 110 K/W for the SSOP20; the
maximum sine wave power dissipation is:
For T
Thermal design considerations
The ‘measured’ thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. All surface mount packages rely on the
traces of the PCB to conduct heat away from the package.
To improve the heat flow, a significant area on the PCB
must be attached to the (ground) pins. Data may not be
comparable between different semiconductor
manufacturers because the application boards and test
methods are not (yet) standardized. Also, the thermal
performance of packages for a specific application may be
different than presented here, because the configuration of
the application boards (copper area) may be different.
NXP Semiconductors uses FR-4 type application boards
with 1 oz copper traces with solder coating Solder Resist
Mask (SRM).
The SSOP20 package has improved thermal conductivity
which reduces the thermal resistance. Using a practical
PCB layout (see Fig.18) with wider copper tracks to the
corner pins and just under the IC, the thermal resistance
from junction to ambient can be reduced to approximately
80 K/W. For T
dissipation for this PCB layout is:
The thermal resistance for the SO20 is approximately
55 K/W if applied to a PCB with wider copper tracks to the
corner pins and just under the body of the IC.
The maximum total power dissipation for this practical
application is:
2002 Jan 04
150 25
--------------------- -
150 60
--------------------- -
150 60
--------------------- -
amb
2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
110
110
55
–
–
–
= 25°C if not specially mentioned; V
amb
= 60 °C the maximum total power dissipation is:
=
=
=
L
1.14 W
0.82 W
1.63 W
= 8 Ω, G
amb
= 60 °C the maximum total power
v
= 20 dB, audio band-pass
150 60
--------------------- -
80
–
DD
=
= 5 V;
1.12 W
15
BTL application
The BTL application diagram is illustrated in Fig.4.
The quiescent current has been measured without any
load impedance. The total harmonic distortion as a
function of frequency was measured with a low-pass filter
of 80 kHz. The value of capacitor C3 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C3 increases the performance of the SVRR.
Headphone application
T
f = 1 kHz, R
22 Hz to 22 kHz.
For headphone application diagram see: Fig.4
If a headphone is plugged into the headphone jack, the
HPS pin will switch-off the outputs of the SLAVE output
stage, this results in a mute attenuation >80 dB for the
loudspeakers. In this condition the quiescent current will
be reduced.
General remarks
Reduction of the value of capacitor C3 results in a
decrease of the SVRR performance at low frequencies.
The capacitor value of C5 and C6 in combination with the
load impedance of the headphone determines the low
frequency behaviour.
To prevent against high output currents during inserting
the headphone into the headphone jack, resistors of 5.1 Ω
have to be connected in series with the SE output lines.
The UP/DOWN pin can be driven by a 3-state logic output
stage (microprocessor) without extra external
components. If the UP/DOWN pin is driven by
push-buttons, then it is advised to have an RC-filter
between the buttons and the UP/DOWN pin. Advised
values for the RC-filter are 2.2 kΩ and 100 nF. Resistor R4
is not necessary for basic operation, but is advised to
keep C6 charged to a voltage of 0.5V
advantage that the plop noise when inserting the
headphone plug is minimal. If the headphone sense
function (HPS) is not used then the HPS-pin 4 should be
hard-wired to ground. This pin should never be left
unconnected.
Using double push buttons, the volume step for both
channels can be controlled. When for the balance control
only a single contact is used, the balance steps are
1.25 dB. If double contacts are used for the balance
buttons and the dashed connection is made, then the
balance steps are 2.5 dB.
amb
= 25°C if not specially mentioned, V
L
= 32 Ω, G
TDA8552T; TDA8552TS
v
= 14 dB, audio band-pass
Product specification
DD
This has the
DD
= 5 V,