TDF8599TD/N2,512 NXP Semiconductors, TDF8599TD/N2,512 Datasheet - Page 47

• Manufacturer Part Number: TDF8599TD/N2,512
• Description: IC AMP AUDIO PWR 85W D 36HSOP
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of TDF8599TD/N2,512

• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 85W x 1 @ 1 Ohm; 70W x 2 @ 2 Ohm
• Voltage - Supply: 8 V ~ 18 V
• Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 36-HSOP
• Operational Class: Class-D
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.02@4Ohm@1W%
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 15W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 8V
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 36
• Package Type: HSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935287028512

NXP Semiconductors
16. Handling information
17. Soldering of SMD packages
TDF8599_2
Product data sheet
17.1 Introduction to soldering
17.2 Wave and reflow soldering
17.3 Wave soldering
In accordance with SNW-FQ-611-D. The number of the quality specification can be found
in the Quality Reference Handbook. The handbook can be ordered using the code
9398 510 63011.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Key characteristics in wave soldering are:
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Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Rev. 02 — 30 July 2009
I
2
C-bus controlled dual channel class-D power amplifier
TDF8599
© NXP B.V. 2009. All rights reserved.
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