SA58672TK,138 NXP Semiconductors, SA58672TK,138 Datasheet - Page 23

• Manufacturer Part Number: SA58672TK,138
• Description: IC AMP AUDIO 3W MONO D 10HVSON
• Manufacturer: NXP Semiconductors
• Type: Class Dr

Specifications of SA58672TK,138

• Output Type: 1-Channel (Mono)
• Package / Case: 10-HVSON
• Max Output Power X Channels @ Load: 3W x 1 @ 4 Ohm
• Voltage - Supply: 2 V ~ 5.5 V
• Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Product: Class-D
• Output Power: 3 W
• Common Mode Rejection Ratio (min): 69 dB
• Thd Plus Noise: 0.08 %
• Operating Supply Voltage: 3 V, 5 V
• Supply Current: 3.4 mA
• Maximum Power Dissipation: 3.12 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935286769138; SA58672TK-T; SA58672TK-T

NXP Semiconductors
SA58672_4
Product data sheet
15.3.1 Stand off
Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description” .
The stand off between the substrate and the chip is determined by:
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 19. Temperature profiles for large and small components
•
•
•
•
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
The amount of printed solder on the substrate
The size of the solder land on the substrate
temperature
MSL: Moisture Sensitivity Level
Lead-free process (from J-STD-020C)
Figure
19.
Rev. 04 — 8 June 2009
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
)
260
250
245
350 to 2000
Table
3.0 W mono class-D audio amplifier
8.
temperature
peak
> 2000
260
245
245
SA58672
© NXP B.V. 2009. All rights reserved.
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