TDA1517P/N3,112 NXP Semiconductors, TDA1517P/N3,112 Datasheet - Page 12

• Manufacturer Part Number: TDA1517P/N3,112
• Description: IC AMP AUDIO PWR 6W STER 18HDIP
• Manufacturer: NXP Semiconductors
• Type: Class Br

Specifications of TDA1517P/N3,112

• Output Type: 2-Channel (Stereo)
• Package / Case: 18-DIP (0.300", 7.62mm) Exposed Pad
• Max Output Power X Channels @ Load: 6W x 2 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Product: Class-B
• Output Power: 6 W
• Available Set Gain: 20 dB
• Thd Plus Noise: 0.1 %
• Operating Supply Voltage: 14.4 V
• Supply Current: 40 mA
• Maximum Power Dissipation: 15000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Audio Load Resistance: 4 Ohms
• Input Signal Type: Single
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Single
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 6 V
• Operational Class: Class-B
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Output Power (typ): 6x2@4OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.1@4Ohm@1W%
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 15W
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 80dB
• Single Supply Voltage (min): 6V
• Single Supply Voltage (max): 18V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 18
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1128-5; 935261850112; TDA1517PN

NXP Semiconductors
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Notes
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2. For PMFP packages hot bar soldering or manual soldering is suitable.
2004 Feb 18
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
2 x 6 W stereo power amplifier
(2)
PACKAGE
−
suitable
−
DIPPING
12
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
SOLDERING METHOD
suitable
suitable
not suitable
TDA1517; TDA1517P
(1)
WAVE
Product specification
stg(max)
). If the