53892-7 TE Connectivity, 53892-7 Datasheet - Page 4

Power to the Board CONTACT CRIMP 18-12 Series 1

53892-7

Manufacturer Part Number
53892-7
Description
Power to the Board CONTACT CRIMP 18-12 Series 1
Manufacturer
TE Connectivity
Series
Series Ir
Datasheets

Specifications of 53892-7

Product Type
Contacts
Termination Style
Crimp
Contact Plating
Gold (30)
Contact Material
Copper
Wire Gauge Range
18-12
Wire Size (awg)
18-12
Termination Method To Wire/cable
Crimp
Ul File Number
E28476
Csa File Number
LR7189
Wire/cable Type
Discrete Wire
Make First / Break Last
No
Contact - Rated Current (a)
31
Operating Voltage Reference
AC
Operating Voltage (vac)
600
Wire/cable Size (awg)
12 – 18
Wire/cable Size (mm²)
0.811 – 3.09
Wire/cable Size (cma)
1,601 – 6,098
Profile Height (y-axis) (mm [in])
3.05 [0.120]
Length (x-axis) (mm [in])
18.29 [0.720]
Width (z-axis) (mm [in])
3.76 [0.148]
Underplate Material Thickness (µm [?in])
1.27 [50.000]
Contact Type
Pin/Socket
Contact Plating, Mating Area, Material
Gold
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Contact Base Material
Copper
Contact Design
Spring Latch
Underplate Material
Nickel
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Vde Tested
No
Agency/standard
UL, CSA
Ul Rating
Recognized
Csa Certified
Yes
Operating Temperature (°c [°f])
-40 – +75 [-40 – +167]
Applies To
Wire/Cable
Accepts Wire Insulation Diameter, Range (mm [in])
0.864 – 0.914 [0.034 – 0.036]
Accepts Wire Material
Copper
Application Use
Wire-to-Wire
Contact Transmits (typical Application)
Power
Packaging Method
Loose Piece
Lead Free Status / Rohs Status
 Details
3.6.
Rev B
Product Qualification and Requalification Test Sequence
NOTE
(a)
(b)
(c)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Discontinuities shall not be measured. Energize at 18°C level for 100% loadings per Test
Specification 109-151.
Exam ination of product
Term ination resistance
Insulation resistance
Dielectric withstanding voltage
Tem perature rise vs current
Solderability
Crim p tensile
Vibration
Physical shock
Contact retention
Durability
Mating force
Unm ating force
Therm al shock
Hum idity-tem perature cycling
Tem perature life
Mixed flowing gas
Test or Exam ination
Figure 2
1,10
3,7
11
5
6
9
4
2
8
1
Test Sequence (b)
Test Group (a)
6(c)
1,9
2,7
3,8
2
5
4
3,7
1,8
2,6
3
4
5
1,3
2
4
108-11026
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