1-2013496-1 TE Connectivity, 1-2013496-1 Datasheet - Page 7

FFC / FPC Connectors 0.3MM 31POS FPC/FCC LCP HSG

1-2013496-1

Manufacturer Part Number
1-2013496-1
Description
FFC / FPC Connectors 0.3MM 31POS FPC/FCC LCP HSG
Manufacturer
TE Connectivity
Datasheets

Specifications of 1-2013496-1

Product Type
PCB
Pitch
0.3 mm
Number Of Positions / Contacts
31
Mounting Angle
Right
Mounting Style
SMD/SMT
Actuation Type
ZIF
Contact Location
Bottom Contact
Termination Style
Solder Pin
Wire Type
FPC
Termination Method To Pc Board
Surface Mount
Pcb Mounting Orientation
Right Angle
Pcb Mount Alignment
Without
Pcb Mount Retention
With
Actuator Type
Rear Flip (Front Hinge)
Shrouded
Yes
Sealed
No
Strain Relief
Without
Contact Current Rating, Max (a)
0.2
Operating Voltage Reference
AC
Operating Voltage (vac)
50
Shielded
No
Tail Orientation
Staggered
Profile Height (y-axis) (mm [in])
1.20 [0.047]
Centerline (mm [in])
0.30 [0.012]
Number Of Positions
31
Selectively Loaded
No
Pcb Mount Retention Type
Solder Pads
Length (x-axis) (mm [in])
11.10 [0.437]
Width (z-axis) (mm [in])
2.90 [0.114]
Contact Plating, Mating Area, Material
Gold
Contact Plating, Mating Area, Thickness (µm [?in])
0.1 [3.937]
Tail Plating Material
Gold
Tail Plating, Thickness (µm [?in])
0.1 [3.93]
Contact Design
Single Beam
Housing Material
Liquid Crystal Polymer (LCP)
Contact Mating Location
Bottom
Flex Cable Thickness (mm [in])
0.2 [0.008]
Housing Color
Beige
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Circuit Identification Feature
Without
Operating Temperature (°c [°f])
-25 – +85 [-13 – +185]
Zif/non-zif
ZIF
Contact Transmits (typical Application)
Signal (Data)
Pick And Place Cover
Without
Packaging Method
Tape & Reel
3.5.16 塩水噴霧
3.5.16 Salt Spray
3.5.17 温度サイクル
3.5.17 Change of Temperature
Rev. C
Para.
項目
Test Items
試験項目
目視にて著しいサビが発生して
いないこと。
By visual inspection, without
noticeable rust.
総合抵抗:100mΩ以下 (終期)
外観に異常なきこと。
Termination Resistance:
No physical damage allowed.
Product Specification
Fig. 1 (終り) Fig. 1 (End)
Requirements
100mΩMax(Final)
嵌合したコネクタを35±2℃, 濃度5±1%
へ48時間暴露後、水洗いし、常温中に1時
間放置した後観察する。
Mated Connector shall be subjected
continuous to a fine mist of salt
solution at temperature of 35±2℃ for
48hr (Salt solution : 5±1%/w). Then in
shall be subjected to standard
atmospheric condition for 1hr, after
which measurement shall be made.
After removing the salt deposits by
water, the appearance shall be checked.
嵌合したコネクタを-55±3℃/30分、常温
10~15分、85±2℃/30分、常温10~15分
これを1サイクルとした槽へ5サイクル放
置後、常温中に1時間放置し測定する。
Mated connector shall stored at
following atmosphere,
-55°C / 30 min, Room Temp:10~15min.
Making this a cycle, repeat 5 cycles. Then in
shall be subjected to standard
atmospheric condition for 1hr, after
which measurement shall be made.
85°C / 30 min. Room Temp:10~15min.
Procedures
108-78351
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