SC16C654BIA68,512 NXP Semiconductors, SC16C654BIA68,512 Datasheet - Page 55

• Manufacturer Part Number: SC16C654BIA68,512
• Description: ID QUAD UART 64BYTE 68PLCC
• Manufacturer: NXP Semiconductors

Specifications of SC16C654BIA68,512

• Features: False-start Bit Detection
• Number Of Channels: 4, QUART
• Fifo's: 64 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 68-LCC (J-Lead)
• Transmit Fifo: 64Byte
• Receive Fifo: 64Byte
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Package Type: PLCC
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935274935512; SC16C654BIA68; SC16C654BIA68

Philips Semiconductors
13. Abbreviations
9397 750 14965
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 30:
Acronym
BRG
CPU
DMA
FIFO
ISDN
LSB
MSB
QUART
UART
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Baud Rate Generator
Central Processing Unit
Direct Memory Access
First-In, First-Out
Integrated Service Digital Network
Least Significant Bit
Most Significant Bit
4-channel (Quad) Universal Asynchronous Receiver and Transmitter
Universal Asynchronous Receiver and Transmitter
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
Rev. 02 — 20 June 2005
SC16C654B/654DB
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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